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Method for fixing small column-shaped metal body arrays

A fixing method and columnar technology, which are applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problem of inability to achieve uniform flow/electric field distribution and efficient removal of processed products, the size and length of metal tiny cylinders vary, and the metal tiny The problem of small size of the columnar body can achieve the effect of fixed arrangement and electrical connection, small effect of force and heat, and small deformation.

Inactive Publication Date: 2013-09-18
HENAN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size, low rigidity, and often large number of metal micro-pillars used in the above practice, it is extremely difficult to effectively and reliably fix them regularly and form an array by conventional methods. "method" to manufacture these metal micro-column arrays, such as EDM reverse copy method, electrolytic machining reverse copy method and wire electric discharge wire cutting method, etc.
However, due to the above-mentioned manufacturing method, which is particularly affected by factors such as flow field, electric field, and processing product exclusion, it is impossible to achieve uniform distribution of flow / electric field and efficient removal of processing products when processing metal micro-columnar bodies. In addition, the processing gap is small. The control factors are complicated, and the small metal cylinders produced and formed are often of different sizes and lengths, which seriously affect the use effect
Obviously, the method of fixed integration after single-piece manufacturing can largely solve the geometric shape and size differences between the individuals in the array of metal micro-pillars, but how to make these tiny metal columns that are easy to be stressed and deformed by heat reliable And it can be fixed and integrated to form an array with mutual conductive connection, which is very difficult

Method used

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  • Method for fixing small column-shaped metal body arrays
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  • Method for fixing small column-shaped metal body arrays

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Embodiment Construction

[0021] Combine below figure 1 , figure 2 and image 3 The specific implementation process of the present invention - "a method for fixing metal micro-pillar arrays" will be further described in detail.

[0022] (a) Insert several metal micro-pillar arrays 1 regularly on the paraffin layer 2 with a thickness of 2 mm, so that the roots 4 of the metal micro-columnar bodies 3 with a diameter of 200 μm and a length of 1 mm are exposed on the surface of the paraffin layer 2 by 50 μm.

[0023] (b) Electroplating a copper metal layer 6 with a thickness of about 1 mm on the surface 5 of the paraffin layer where the roots 4 of the metal micro-columnar bodies 3 are exposed.

[0024] (c) Melting to remove paraffin layer 2.

[0025] Through the above method steps, the regular and reliable fixation of the metal micro-pillars on the copper metal layer can be realized.

[0026] The above are specific embodiments of the present application, and it should be understood that these embodimen...

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Abstract

The invention discloses a method for fixing small column-shaped metal body arrays. The method comprises the steps as follows: (a) regularly inserting the small column-shaped metal body arrays (1) into a paraffin layer (2) and exposing root parts (4) of small column-shaped metal bodies (3) to the surface of the paraffin layer (2); (b) plating the surface (5) of the paraffin layer, to which the root parts (4) of the small column-shaped metal bodies (3) are exposed, with a metal layer (6) having certain thickness; and (c) removing the paraffin layer (2) by melting. According to the method, low-cost, soft and easily-molten paraffin is taken as an early positioning medium for the small column-shaped metal bodies, the column-shaped bodies are fixed and bonded through low-temperature metal electroplating or chemical plating, the operation is simple, the technological process has small force and heat effects on the small column-shaped metal bodies, the fixing operation is efficient and reliable, the cost is low, and mounting and fixing problems of the small column-shaped metal body arrays are satisfactorily solved.

Description

technical field [0001] The invention relates to a method for fixing and installing a columnar body array, in particular to a method for fixing a metal tiny columnar body array. Background technique [0002] In the practice of industrial production and scientific research, it is often necessary to regularly fix several metal micro-pillars together to form an array to achieve certain specific purposes. For example, bioelectrode arrays for measuring biological signals. Another example is an EDM / ECM columnar electrode array or a mechanical stamping head array for forming tiny group holes. Due to the small size, low rigidity, and often large number of metal micro-pillars used in the above practice, it is extremely difficult to effectively and reliably fix them regularly and form an array by conventional methods. "method" to manufacture these metal micro-column arrays, such as EDM reverse copy method, electrolytic machining reverse copy method and wire electric discharge wire cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P11/00
Inventor 明平美李建中刘志超吕文星张新民商静瑜郝巧玲王俊涛包晓慧李慧娟
Owner HENAN POLYTECHNIC UNIV
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