Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Quick heat dissipation PCB

A fast, heat sink technology, applied in the direction of circuit heat devices, printed circuit components, electrical components, etc., can solve the problems of increased heat flux density, increased power consumption of a single component, etc., to improve heat dissipation performance, increase heat dissipation speed, compact effect

Inactive Publication Date: 2018-02-09
DONGGUAN SHENGYI ELECTRONICS
View PDF14 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] On the other hand, with the development of electronic product technology, the trend of surface mount and miniaturization of components is becoming more and more obvious, the density of electronic products is constantly increasing, the main frequency of components is constantly increasing, and the power consumption of a single component is gradually increasing , resulting in a sharp increase in the heat flux

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Quick heat dissipation PCB
  • Quick heat dissipation PCB
  • Quick heat dissipation PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] like figure 1 and 2 As shown, a rapid heat dissipation PCB, the surface of the PCB is designed with a heat source area 1 for installing a heating element 10, the PCB is provided with a heat dissipation slot 2 corresponding to the heat source area 1, and the heat dissipation slot 2 is located on the PCB away from all the On one side of the heat source area 1, a metal block 3 is arranged in the heat dissipation groove 2, and the PCB is also provided with at least one metallized hole 4 corresponding to the heat source area 1, and one end of the metallized hole 4 is connected to the The heat source area 1 is connected, and the other end of the metallized hole 4 is connected to the metal block 3 .

[0058] In this embodiment, the heating element 10 is a high-power component, and the heat source area 1 is the PCB surface covered by the heating element 10 when it is connected to the PCB. The heating element 10 is fixed on the heat source area 1 of the PCB by surface mount te...

Embodiment 2

[0066] The difference between this embodiment and the first embodiment is that:

[0067] like image 3 and 4 As shown, the metallized hole 4 is a through hole, and one end of the metallized hole 4 away from the heat source region 1 penetrates the metal block 3 . Under this structure, the heat of the heating element 10 is dissipated simultaneously through two branches, and the first branch is that the heat of the heating element 10 is transferred to the upper part of the metal block 3 through the metallized hole 4 surface, and then the heat is transferred from the upper surface to the lower surface through the metal block 3 to realize the external dissipation of heat; the second branch is that the heat of the heating element 10 is directly transferred through the metallized hole 4 to the The lower surface of the metal block 3 then realizes the external dissipation of heat.

Embodiment 3

[0069] The difference between this embodiment and the first embodiment is that:

[0070] like Figure 5 and 6 As shown, the PCB is also provided with a number of peripheral vias 6, the peripheral vias 6 are located outside the heat dissipation slot 2, and the peripheral vias 6 have metallized sidewalls penetrating the Through holes of the PCB, the peripheral through holes 6 are not in direct contact with the heat sink 2 . Specifically, the peripheral vias 6 not only realize the electrical conduction between the circuit layers, but also realize the transfer of the heat of the inner circuit layer 9 to the surface of the PCB.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of PCBs, and discloses a quick heat dissipation PCB. The surface of the PCB is designed to be provided with a heat source region for installing a heating element. The PCB is provide with a heat dissipation groove corresponding to the heat source region, and the heat dissipation groove is located at one side, far from the heat source region, of the PCB.The interior of the heat dissipation groove is provided with a metal block, and the PCB is also provided with at least one metalized hole corresponding to the heat source region. One end of the metalized hole is connected with the heat source region, and the other end of the metalized hole is connected with the metal block. Through the setting of the metalized hole which is connected with the heating element and the metal block, the PCB can enable the heat on the heating element to be directly transferred to the metal block, and effectively improves the heat transfer efficiency, thereby improving the heat dissipation performance of the PCB, improving the operation stability of the PCB, and prolonging the service life of the PCB.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a rapid heat dissipation PCB. Background technique [0002] A printed circuit board (PCB for short) is a provider of electrical connections for electronic components. Before the advent of printed circuit boards, the interconnection between electronic components was based on direct connection of wires to form a complete circuit or through a simple circuit panel connection. In contemporary times, circuit panels only exist in various laboratories as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] On the one hand, printed circuit boards have developed from single-layer to double-sided, multi-layer boards and flexible boards, and are constantly developing in the direction of high precision, high density and high reliability. Continuously shrinking the size, reducing the cost, and improving the per...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0204H05K1/0206H05K2201/10416
Inventor 肖璐纪成光李民善王洪府
Owner DONGGUAN SHENGYI ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com