Induction device and electronic equipment

Abstract

The invention discloses an induction device comprising an induction component; a packaging layer which is arranged on the induction component; and a nanometer thin-film layer which is arranged on the upper surface of the packaging layer, wherein the lower surface of the nanometer thin-film layer is directly contacted with the upper surface of the packaging layer. The nanometer thin-film layer is directly formed on the upper surface of the packaging layer through a spraying technology. The nanometer thin-film layer has relatively high sensitivity and can realize sufficient scratch-resistant and wear-resistant protection and can be directly contacted with the packaging layer to present as the appearance, and the nanometer thin-film layer has higher connection strength with the packaging layer so that the device structure is enabled to be more stable. The invention also discloses electronic equipment comprising a shell which comprises a first window; and an induction module group which is the induction module group provided by the aforementioned embodiment, wherein the upper surface of the nanometer thin-film layer of the module group is exposed through the first window of the shell, and the lower surface is directly contacted with the upper surface of the packaging layer of the module group. The electronic equipment adopts the induction device so as to meet the requirement of long-term use.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a sensing device and an electronic equipment. Background technique [0002] The fingerprint module is the core component of the fingerprint lock, which is installed on devices such as fingerprint access control or hard disk, and is used to complete the collection and identification of fingerprints. The fingerprint module is mainly composed of a fingerprint collection module, a fingerprint identification module and an extended function module (such as a lock driver module). [0003] Among them, the fingerprint collection module is generally the packaging material on the surface of the module. This material plays a role in packaging the fingerprint identification components, and the exposed side is used as the surface of the module. The fingerprint is collected by contact with the finger to realize the fingerprint identification function. [0004] In practical applica...

AI Technical Summary

Problems solved by technology

All of the above methods will make the surface thickness of the fingerprint module thicker, the recognition rate is poor, and the cost is high

[0005] At the same time, during long-term use, the connection between the cover plate and the surface of the module is prone to loosening, or due to the natural aging of the glue, which will cause the cover plate to fall off, resulting in the inability to stably connect the cover plate and the surface of the module for a long time

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