A kind of production method of leadless gold-plated circuit board
A technology of leadless gold plating and production method, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuits, etc., can solve problems such as increased labor costs, and achieve the effect that will not affect the stability of the process
Active Publication Date: 2018-09-25
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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Problems solved by technology
However, this method changes the existing production conditions, and it is necessary to evaluate the product quality and process stability of the additive
In addition, production conditions need to be controlled to ensure the effectiveness of additives, which also increases labor costs
Method used
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Embodiment Construction
[0028] Embodiments of the present invention are described in detail below:
[0029] see figure 1 , the production method of leadless gold-plated circuit board of the present invention, comprises the steps:
[0030] S101. When making a circuit graphic file, select the copper wire 20 connected to the golden finger 10 from the circuit graphic, and determine the first copper on the copper wire 20 whose distance from the golden finger 10 is within the first threshold range The line segment 21 and the second copper line segment 22 whose distance from the gold finger 10 is within a second threshold range, both ends of the first copper line segment 21 are connected to the gold finger 10 and the second copper line segment 22 respectively.
[0031] Wherein, the first threshold range is (0, S], the second threshold range is [S, ∞), and S is [200 μm, 400 μm]. The second compensation value of the line width compensation widening of the second copper line segment 22 remains unchanged.
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The invention discloses a method for producing a leadless gold-plated circuit board. The method comprises the following steps: selecting a copper wire connected with a gold finger, and determining a first copper wire segment having a distance with the gold finger within a first threshold range and a second copper wire segment having a distance with the gold finger within a second threshold range on the copper wire; on the basis of the original design wire width of the copper wire, carrying out a compensation widening treatment on the wire widths of the first copper wire segment and the second copper wire segment, wherein a first compensation value of the wire width compensation widening of the first copper wire segment gradually becomes small on a direction away from the gold finger; and manufacturing the leadless gold-plated circuit board according to a circuit graphic file. After the method for producing the leadless gold-plated circuit board is adopted, in an ultra-roughening treatment of the circuit board before solder resist, the wire width compensation widening part is etched by the Javani effect, and the final wire width of the copper wire is close to the theoretical design wire width. In addition, the existing production conditions and the final design requirements of circuit board products do not need to be changed, the stability in the manufacture procedure will not be influenced, and no adverse effect is generated on the product performance.
Description
technical field [0001] The invention relates to a production method of a circuit board, in particular to a production method of a leadless gold-plated circuit board. Background technique [0002] The leadless gold plating process does not need to arrange plating leads at the extended position of fingers, which can effectively improve the wiring density of the package substrate. The leadless gold plating process adopts the method of nickel gold plating first and then solder resist, so copper and gold exist in the same line after nickel gold plating. During the pre-treatment of super-roughening, due to Cu-2e=Cu 2+ (V Cu =+0.337V), Au-e=Au + (V Au =+1.691V), there is a large potential difference between the two metals, resulting in a galvanic cell effect (that is, the Giavanni effect). This will lead to an increase in the amount of etching of the copper wire connected to the gold finger, and a reduction in the width of the copper wire. In severe cases, the width of the cop...
Claims
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IPC IPC(8): H05K3/06H05K1/11
CPCH05K1/117H05K3/06H05K2201/09281H05K2201/09427
Inventor 林益李志东邱醒亚
Owner GUANGZHOU FASTPRINT CIRCUIT TECH