Alignment method for exposure machine

An exposure machine and alignment mark technology, applied in the field of photolithography, can solve the problems of production stagnation, production cost waste, etc.

Active Publication Date: 2016-06-01
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This will cause a long period of production stagnation ...

Method used

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  • Alignment method for exposure machine
  • Alignment method for exposure machine
  • Alignment method for exposure machine

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Embodiment Construction

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no interveni...

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Abstract

The invention discloses an alignment method for an exposure machine. The alignment method comprises the following steps of taking any one of multiple alignment marks from a same alignment region as the reference alignment mark, and taking other alignment marks except the reference alignment mark as backup alignment marks; performing alignment by the reference alignment mark; choosing one of the backup alignment marks for performing alignment when the alignment is unsuccessful by the reference alignment mark; and when the alignment is also unsuccessful by the chosen backup alignment mark, repeatedly performing the operation of choosing one of the backup alignment marks for performing alignment. According to the alignment method for the exposure machine, after one time of wrong alignment occurs, the backup alignment marks are chosen automatically for performing alignment again; and therefore, the waste of production cost caused by automatic alarm and machine halt when the reference alignment is unsuccessful of the exposure machine, or the out-of-service of a substrate caused by partial failed alignment are avoided.

Description

【Technical field】 [0001] The invention relates to the technical field of photolithography, in particular to an alignment method of an exposure machine. 【Background technique】 [0002] In the photolithography process, the alignment of the exposure machine directly determines the coincidence accuracy, but due to factors such as graphic defects and film quality abnormalities caused by poor process production, there will often be alignment failures caused by abnormal alignment marks, and it must be manually operated after the alarm Re-alignment will seriously affect the production beat. At the same time, manual alignment may also fail to complete the alignment due to local defects in the alignment mark of the substrate, and the product substrate is scrapped, resulting in waste of production costs. [0003] The existing solution is that when an abnormal alignment alarm occurs on the exposure machine, engineers need to judge the cause of the failure, modify the alignment mark par...

Claims

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Application Information

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IPC IPC(8): G03F9/00G03F7/20
Inventor 刘晓佳邓亮
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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