Heat dissipation structure of wearable electronic devices

Abstract

The invention provides a heat dissipation structure of a wearable electronic device. The heat dissipation structure of the wearable electronic device comprises a wearable main body and a wearable band body connected to the wearable main body. The wearable main body comprises an accommodating space, a circuit board and a plurality of electronic components disposed on the circuit board. The electronic components have at least one heat source. The wearable band body is provided with a heat-conducting part and a protection part covering the outer side of the heat-conducting part. A portion of the heat-conducting part is exposed into the accommodating space and is in contact with the corresponding heat sources on the circuit board. Thus, the heat dissipation efficiency of wearable electronic devices is greatly increased.

Description

【Technical field】 [0001] The present invention relates to a wearable electronic device, in particular to a heat dissipation structure for the wearable electronic device for dissipating heat. 【Background technique】 [0002] In addition to mobile phones and tablets, the current mobile devices have also expanded to watches, necklaces, and rings, and have also become smart wearable electronic devices with multiple functions. With the increasing functions, touch screens and central processing units (Central Processor Unit, CPU) are also added. , Graphic Processing Unit (Graphic Processing Unit, GPU and satellite positioning chip and many other components, and the smart watch can be used with other mobile devices through Bluetooth or network connection, and can also be inserted into the SIN card for 3G or 4G network Use and calling functions. [0003] However, currently known smart watches (or wearable watches) have internal main computing chips (such as central processing unit (...

AI Technical Summary

Problems solved by technology

[0003] However, currently known smart watches (or wearable watches) have internal main computing chips (such as central processing unit (Central Processor Unit, CPU), graphics processing unit (Graphic Processing Unit, GPU)) to operate or execute When heat is generated, but this heat cannot be dissipated quickly, so that the heat inside the smart watch will continue to accumulate (or accumulate heat) on the central processing unit or graphics processing unit itself and its surroundings, resulting in the The smart watch has the problem of operation delay or severe case even crash, and when the user wears the smart watch, it will be affected by the internal local heat, which will cause the user's wrist to feel uncomfortable, so how to deal with it The heat dissipation of smart watches and various wearable mobile devices is the current top priority.

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