Experimental circuit board
An experimental circuit and substrate technology, applied in the electronic field, can solve problems such as poor contact, short circuit, cumbersome operation, etc., and achieve the effect of simple and convenient use
Inactive Publication Date: 2016-06-15
潘爱松
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AI Technical Summary
Problems solved by technology
The traditional experimental method is usually to solder the components on the universal circuit board, and then remove it after the test; this method is cumbersome to operate, and it is easy to damage the electronic components and the circuit board
If you do not use a circuit board and directly connect the components with wires, it will easily lead to poor contact, short circuit, etc. If there are many electronic components, you cannot use wires to connect them.
Method used
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Experimental program
Comparison scheme
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Embodiment Construction
[0012] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
[0013] For the first implementation, see Figure 1~2 shown. A kind of experimental circuit board, comprises base plate 1, base plate 2; Described base plate 1 is positioned at the top, and base plate 1 is provided with many circular holes 3a, and every 4 circular holes are a group, a group of 4 circular holes surrounds Form a square area, which is marked by the dotted box 4. The bottom plate 2 is located below; the bottom plate 2 is provided with many round holes 3b, the number and position of the round holes are the same as those of the base plate. An intermediate layer is provided between the base plate 1 and the base plate 2. The intermediate layer adopts an insulating plate 5, and the insulating plate 5 is provided with many hollowed-out square holes. A square hole corresponds to 4 circular holes on the base plate 1, namely Corresponding to a grou...
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An experimental circuit board, comprising a base plate and a base plate; the base plate and the base plate are provided with a plurality of round holes for component pins to pass through; the position of each round hole on the base plate is the same as the position of each round hole on the base plate One to one correspondence. An intermediate layer is arranged between the base plate and the bottom plate, and a plurality of metal wire balls are placed in the intermediate layer, and the positions of the metal wire balls correspond to the positions of the round holes of the base plate; an insulating material is arranged between each metal wire balls separated. Because the wire ball is elastic, penetrable, and conductive, the pins of the electronic components are easy to pass through; the pins are clamped by the metal wire after being penetrated, and it is not easy to loosen and fall out; and it can be inserted into the same wire ball The component circuits of the pins are connected; making it very simple and convenient to make electronic circuit experiments.
Description
technical field [0001] The invention belongs to the field of electronics, and in particular relates to an experimental circuit board. Background technique [0002] When students make experiments on electronic components, they usually test the effect of each electronic component after it is connected according to the set circuit; so after the test is completed, each component must be removed from the circuit board. The traditional experimental method is usually to solder the components on the universal circuit board, and then remove them after the test; this method is cumbersome to operate, and it is easy to damage the electronic components and the circuit board. If you do not use a circuit board and directly connect the components with wires, it will easily lead to poor contact, short circuit, etc. If there are many electronic components, you cannot use wires to connect them. Contents of the invention [0003] In order to solve the above-mentioned problems of using tradit...
Claims
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Patent Timeline
Login to View More IPC IPC(8): G09B23/18
CPCG09B23/183
Inventor 潘爱松
Owner 潘爱松