linbo 3 Chip polishing method for integrated optical devices

Abstract

The invention relates to a grinding method for a LiNbO3 integrated optical device chip. The method includes the following steps: (1) processing a chip: performing cutting-up forming on a chip to be grinded, and cleaning and drying the chip to be grinded; (2) bonding an accompany piece on the chip: coating an end surface of the processed chip with glue, and then bonding the accompany piece on the processed chip, performing tabletting and solidifying on the processed chip with the accompany piece; (3) assembling the chip: cleaning the end surface and the surface of the bonded chip, arranging the bonded chip on a grinding clamp for grinding; and (4) grinding the chip: firstly, performing coarse grinding, secondly, performing fine grinding, and finally, performing polishing treatment, and then checking the grinding quality of the chip. Compared with the prior art, the method is more accurate in grinding removal amount, can ensure flat end surface of a working face and can avoid turned-down edges, and in this way, the chip loss can be further reduced, and the return loss of the device can be reduced.

Description

Technical field [0001] The invention relates to a chip grinding method, in particular to a LiNbO 3 Chip grinding method for integrated optical devices. Background technique [0002] LiNbO 3 The crystal has a very large linear electro-optic coefficient, has a large transmittance in the light wave wavelength range of 400nm to 4500nm, and the crystal growth process is mature, the price is cheap, and it is the best choice for integrated optical multi-function chips. This device utilizes the electro-optic effect of lithium niobate crystal, has the advantages of fast response (the electro-optic response time is 10-15s), anti-electromagnetic interference, etc., and uses its largest linear electro-optic coefficient r33 (=30.8pm / V ), so LiNbO was introduced 3 The integrated optical multi-function chip is a big leap in the development of fiber optic gyroscope technology. [0003] In the production of integrated optical fiber optic gyroscope multi-function chip, it is necessary to make the L...

AI Technical Summary

Problems solved by technology

while in LiNbO 3 When the chip is ground, the two ends of the cut substrate are very rough, and the rough end surface will cause light scattering, which will greatly reduce the coupling efficiency between the two ends of the waveguide and the optical fiber.

Therefore, it is necessary to directly grind and polish the two end faces of the chip waveguide. The polished end faces must have a certain angle relationship with the waveguide. At the same time, since the diffusion waveguide is formed and is close to the wafer surface, it is easy to cause rounded corners at the intersection of the polished surface and the wafer working surface. Edge collapse, chipping, etc. affect the coupling loss of the waveguide and increase the return loss of the device

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