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Polishing apparatus and controlling the same

A technology of a grinding device and a control method, which is applied in the directions of grinding devices, abrasive surface adjustment devices, grinding machine tools, etc., can solve the problem that the force of the dresser cutting the grinding pad may not be constant.

Active Publication Date: 2016-07-06
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, even if the force with which the dresser presses the pad is constant, the force with which the dresser cuts the pad is not necessarily constant.

Method used

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  • Polishing apparatus and controlling the same
  • Polishing apparatus and controlling the same
  • Polishing apparatus and controlling the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0081] figure 1 It is a schematic diagram which shows the schematic structure of a grinding|polishing apparatus. This polishing apparatus polishes a substrate W such as a semiconductor wafer, and includes a stage unit 1 , a polishing liquid supply nozzle 2 , a polishing unit 3 , a dressing liquid supply nozzle 4 , a dressing unit 5 , and a controller 6 . The workbench unit 1 , the grinding unit 3 and the dressing unit 5 are arranged on the base 7 .

[0082] The table unit 1 has a turntable 11 and a turntable rotation mechanism 12 for rotating the turntable 11 . The turntable 11 has a circular cross section, and a polishing pad 11 a for polishing the substrate W is fixed thereon. The cross section of the polishing pad 11 a is circular like the cross section of the turntable 11 . The turntable rotation mechanism 12 is composed of a turntable motor driver 121 , a turntable motor 122 , and a current detector 123 . The turntable motor driver 121 supplies drive current to the tu...

no. 2 approach

[0124] The second embodiment described next adjusts the rotation speed of the turntable 11 . Hereinafter, differences from the first embodiment will be mainly described.

[0125] Figure 8 It is a block diagram explaining the control at the time of trimming in the second embodiment. In this embodiment, the controller 6 may control the turntable rotation mechanism 12 instead of controlling the pressing mechanism 53 . That is, the controller 6 still considers the fluctuation of the friction coefficient z, and outputs the control signal Nttset(i, j) according to the swing direction i and position j of the dresser 51, so that the cutting force F becomes a predetermined target value Ftrg. At this time, the controller 6 can use a table 61a that predetermines the value of the control signal Nttset(i,j) for setting the cutting force as the target value Ftrg for each swing direction i and position j of the dresser 51 .

[0126] The control signal Nttset(i,j) represents the rotationa...

no. 3 approach

[0138] The third embodiment described next adjusts the rotation speed of the dresser 51 . Hereinafter, differences from the first and second embodiments will be mainly described.

[0139] Figure 11 It is a block diagram explaining the control at the time of trimming in the third embodiment. In this embodiment, the controller 6 may not control the pressing mechanism 53 or the turntable rotating mechanism 12 , but may instead control the trimmer rotating mechanism 54 . That is, the controller 6 still considers the fluctuation of the friction coefficient z, and outputs the control signal Ndrset(i, j) according to the swing direction i and position j of the dresser 51, so that the cutting force F becomes a predetermined target value Ftrg. At this time, the controller 6 can use a table 61b that predetermines the value of the control signal Ndrset(i,j) for setting the cutting force F as the target value Ftrg for each swing direction i and position j of the dresser 51 .

[0140] ...

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Abstract

The invention provides a polishing apparatus including a dresser capable of cutting a polishing pad with approximately constant force and a control method thereof. The polishing apparatus includes: a turn table 11 on which a polishing pad 11a for polishing a substrate W is provided; a turn table rotation mechanism 12 configured to rotate the turn table 11; a dresser 51 configured to dress the polishing pad 11a by cutting the polishing pad 11a; a pressing mechanism 53 configured to press the dresser 51 onto the polishing pad 11a; a dresser rotation mechanism 54 configured to rotate the dresser 51; a swinging mechanism 56 configured to swing the dresser 51 on the polishing pad 11a; and a controller 6 configured to control the pressing mechanism 53, the turn table rotation mechanism 12 or the dresser rotation mechanism 52 based on a position and a swinging direction of the dresser 51.

Description

technical field [0001] The present invention relates to a polishing device including a dresser for a polishing pad and a control method thereof. Background technique [0002] A polishing apparatus typified by a CMP (Chemical Mechanical Polishing) apparatus polishes the surface of a substrate to be polished by relatively moving the polishing pad and the surface of the substrate to be polished while the polishing pad is in contact with the surface of the substrate to be polished. The polishing rate decreases due to the gradual wear of the polishing pad due to the polishing of the substrate to be polished, or the fine unevenness on the surface of the polishing pad. Therefore, the surface of the polishing pad is dressed (dressing) by a dresser that electrodeposits many diamond particles on the surface or a dresser that implants bristles on the surface, thereby forming fine unevenness on the surface of the polishing pad again. (eg, Patent Documents 1 and 2). [0003] The dresse...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017B24B49/16B24B49/10
CPCB24B49/10B24B49/16B24B53/017B24B37/107B24B57/02B24B37/005
Inventor 篠崎弘行
Owner EBARA CORP