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Supporting platform, chip bonding method and device

A support platform and chip technology, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device manufacturing, etc., to achieve the effect of binding

Active Publication Date: 2018-06-12
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a support platform, chip bonding method and device, which can solve the problem of COG Mura in the form of light leakage in the existing display device in the L0 state

Method used

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  • Supporting platform, chip bonding method and device
  • Supporting platform, chip bonding method and device
  • Supporting platform, chip bonding method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] This embodiment provides a support table for supporting a base substrate, the base substrate includes a second area on which a circuit board to be bound is attached and a first area other than the second area, the support Desks include:

[0046] Corresponding to the first supporting portion of the first region, the supporting surface of the first supporting portion can be in contact with the first region to support the base substrate;

[0047] Corresponding to the second support part in the second area, the second support part can move relative to the first support part so as to switch between the first state and the second state, wherein, in the first state , the supporting surface of the second supporting part and the supporting surface of the first supporting part are located on different planes, and in the second state, the supporting surface of the second supporting part and the supporting surface of the first supporting part faces lie on the same plane.

[0048]...

Embodiment 2

[0056] This embodiment provides a chip bonding device, including the above-mentioned supporting platform.

[0057] Further, the device also includes:

[0058] A joint tool located above the support table and corresponding to the second area, the area of ​​the contact surface of the joint tool used to contact the circuit board to be bound is not less than the area of ​​the second area, so that when performing COG pressure , the connector tool is able to apply sufficient pressure to the board to be bonded.

[0059] Further, the device also includes:

[0060] The temperature control module is used to control the first support part to be at a first preset temperature and control the second support part to be at a second preset temperature when the chip fixed on the glass substrate is pressed, wherein the first The first preset temperature is lower than the hardening temperature of the anisotropic conductive adhesive, and the second preset temperature is not lower than the harden...

Embodiment 3

[0065] This embodiment provides a chip binding method, which is applied to the above-mentioned chip binding device, and the method includes:

[0066] controlling the second supporting part to be in the first state, controlling the first supporting part to be at a first preset temperature at the same time, controlling the second supporting part to be at a second preset temperature, wherein the first preset temperature is lower than The hardening temperature of the anisotropic conductive adhesive, the second preset temperature is not lower than the hardening temperature of the anisotropic conductive adhesive;

[0067] placing the base substrate attached with the circuit board to be bound on the first supporting part;

[0068] Controlling the connector tool to move downward until the contact surface contacts the circuit board to be bound, and simultaneously controlling the second support part to move upward until the support surface of the second support part contacts the base su...

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PUM

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Abstract

The invention provides a support table and a chip bonding method and device. The support table is used for supporting a substrate, wherein the substrate comprises a second region and a first region except the second region, the second region is attached to a circuit board to be bonded, the support table comprises a first support part and a second support part, the first support part is in correspondence to the first region, the support surface of the first support part can be in contact with the first region to support the substrate, the second support part is in correspondence to the second region and can move relative to the first support part so that the second support part is switched between a first state and a second state, the support surface of the second support part and the support surface of the first support part are arranged in different planes when the second support is in the first state, and the support surface of the second support part and the support surface of the first support part are arranged in the same plane when the second support is in the second state. With the technical scheme provided by the invention, the problem of chip on glass (COG) Mura in a light leakage form of an existing display device in an L0 state can be solved.

Description

technical field [0001] The invention relates to a manufacturing process of a display device, in particular to a support platform, a chip binding method and a device. Background technique [0002] figure 1 It is a schematic cross-sectional view of a liquid crystal display panel in the prior art, such as figure 1 As shown, the liquid crystal display panel mainly includes a glass substrate 10, a PCB (Printed Circuit Board, printed circuit board) 11, an IC (Integrated Circuit, integrated circuit board) 12, etc., generally using COG (Chip On Glass, fixed on the glass substrate) Chip) bonding (Bonding) method, and through ACF (Anisotropic Conductive Adhesive Film, anisotropic conductive adhesive) 13 to connect the glass substrate 10 and IC12. [0003] The traditional COG binding process mainly includes: glass substrate 10 cleaning, polarizer attachment, ACF13 attachment, COG pre-pressing, COG primary pressing, FPC (flexible circuit board) 14 attachment, PCB11 attachment and othe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687H01L21/603
CPCH01L21/68785H01L24/83H01L2221/68372H01L2224/83002H01L2224/83201H01L2224/83
Inventor 权宁万张文浩
Owner BOE TECH GRP CO LTD