A laser measuring and grinding equipment

A technology of laser measurement and equipment, which is applied in the direction of grinding/polishing equipment, metal processing equipment, grinding machines, etc., can solve the problems that local fine points cannot be further finely processed, and cannot meet the needs of refined products, so as to improve grinding efficiency effect

Active Publication Date: 2018-04-13
SUZHOU HUALAI PHOTOELECTRIC INSTR
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Problems solved by technology

[0002] At this stage, some industries have higher and higher requirements for the fineness of local workpieces. The traditional workpiece surface grinding technology has a better effect on the overall grinding of the workpiece surface, but it cannot be further finely processed for local fine points, which has gradually failed to meet the requirements. Demand for some refined products

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  • A laser measuring and grinding equipment

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Embodiment Construction

[0015] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.

[0016] A laser measurement and grinding equipment, including a control device, a grinding table 1, a measurement component 2 and two sets of grinding components 3, the control device is connected to the measurement component 2 and the grinding component 3 through wires; the measurement component 2 includes a laser head 4, an L-shaped elevated 5 and the measurement track 6 arranged on the grinding table 1 surface, the L-shaped elevated frame 5 is arranged on the measured rail 6, perpendicular to the polished table 1 surface, and the laser head 4 is arranged on the bottom of the crossbar of the L-shaped elevated frame 5; the grinding assembly 3 includes The grinding head 7, the grinding track 9 and the L-shaped low frame 8 arranged on one surface of the grinding table, the L-shaped low frame 8 is arranged on the grinding track 9, and the gri...

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Abstract

The invention discloses laser determining and polishing equipment which comprises a control device, a polishing table, a determining assembly and a polishing assembly. The control device is connected with the determining assembly and the polishing assembly through wires; the determining assembly comprises a laser head, an L-shaped high frame and a determining rail arranged on a polishing table top, the L-shaped high frame is arranged on the determining rail and is perpendicular to the polishing table top, and the laser head is arranged at the bottom of a cross bar of the L-shaped high frame; the polishing assembly comprises a polishing head, a polishing rail and an L-shaped short frame arranged on the polishing table top, the L-shaped short frame is arranged on the polishing rail, and the polishing head is arranged on the side face of a cross bar of the L-shaped short frame through a sliding block. According to the laser determining and polishing equipment, the heights of all sites on the surface of a workpiece are determined through lasers, the fineness is extremely high, the sites, determined to be abnormal, on the surface of the workpiece are polished through the polishing head, and therefore the higher and higher refined requirement of the market on the workpiece is met.

Description

technical field [0001] The invention relates to a grinding device, in particular to a laser measurement grinding device. Background technique [0002] At this stage, some industries have higher and higher requirements for the fineness of local workpieces. The traditional workpiece surface grinding technology has a better effect on the overall grinding of the workpiece surface, but it cannot be further finely processed for local fine points, which has gradually failed to meet the requirements. Demand for some refined products. Contents of the invention [0003] In order to solve the deficiencies of the prior art, the purpose of the present invention is to provide a laser measuring and grinding equipment that uses laser to measure distance and finely grind the surface of workpiece at fixed points. [0004] In order to achieve the above object, the present invention adopts the following technical solutions: [0005] A laser measurement and grinding equipment, including a co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B49/12B24B27/00B24B41/02B24B51/00
CPCB24B27/0076B24B41/02B24B49/12B24B51/00
Inventor 薛文英
Owner SUZHOU HUALAI PHOTOELECTRIC INSTR
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