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Packaging tool and method for diode braids

A diode and tape technology is applied in the field of diode tape packaging and tooling, which can solve the problems that diode tapes cannot be arranged and aligned, diodes are easy to be squeezed and bent, and the failure rate of products is increased, and the tool design is simple and ingenious. Reasonable and compact, the effect of speeding up work efficiency

Active Publication Date: 2016-09-28
NANTONG HORNBY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the past, the diode tapes were packaged manually by placing the diode tapes directly in the packaging box. In this way, the diode tapes could not be arranged and aligned, and the diodes were easily crushed and damaged after packing, resulting in an increase in product failure rate and failure to satisfy customers. demand, causing great loss

Method used

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  • Packaging tool and method for diode braids
  • Packaging tool and method for diode braids
  • Packaging tool and method for diode braids

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Embodiment Construction

[0021] Refer to attached Figure 1-2 , a kind of diode braiding packing tooling, it comprises base 1, first side plate 2 and second side plate 3, base 1 is a rectangular flat plate and the two ends of rectangular flat plate are respectively designed as slope surface 4, one of the plane of rectangular flat plate The first side plate 2 is installed on one side, and the second side plate 3 is installed on the other side.

[0022] The first side plate 2 is a square plate, the lower end of which is mounted on one side of the base, and the two corners of the upper end of the square plate are chamfered respectively.

[0023] The second side plate 3 is a square plate, the lower end of which is installed on one side of the base, and the two corners of the upper end of the square plate are respectively provided with triangular notches 31 . The triangular notch design here is because when the personnel operate, the first side panel is located at the position in front of the person's che...

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PUM

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Abstract

The invention relates to the processing field of packaging of diode braids, in particular to a packaging tool and a packaging method for diode braids. The packaging tool comprises a base, a first side plate and a second side plate, wherein the base is a rectangular flat plate; the two ends of the rectangular flat plate are separately designed into slopes; one side of the flat surface of the rectangular flat plate is provided with the first side plate; and the other side of the flat surface of the rectangular flat plate is provided with the second side plate. The packaging tool has the advantages of being simple and delicate in design, reasonable and compact in structure and convenient to use; and by virtue of the method, working efficiency is quickened, diode braids are guaranteed to be in order, and are not extruded, bent and damaged, so that needs of customers are met, and loss is reduced.

Description

technical field [0001] The invention relates to the field of diode braiding and packaging processing, in particular to a diode braiding and packaging tool and a method thereof. Background technique [0002] In the past, the diode tapes were packaged manually by placing the diode tapes directly in the packaging box. In this way, the diode tapes could not be arranged and aligned, and the diodes were easily crushed and damaged after packing, resulting in an increase in product failure rate and failure to satisfy customers. demand, causing great losses. Contents of the invention [0003] In order to solve the above problems, the present invention proposes a diode braiding and packaging tool and its method. The design of the tooling is simple and ingenious, the structure is reasonable and compact, and it is convenient to use. The method of the present invention speeds up the work efficiency and ensures that the diode braiding is neat and will not be damaged. Squeeze and bend d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B67/02
CPCB65B67/02
Inventor 阚俊丽管玉陆延年石友玲
Owner NANTONG HORNBY ELECTRONICS