Gold thread wiring method for fingerprint product packing structure
A packaging structure and product technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of easy-to-strain wire arcs, increased tension, and wire arc breakage, so as to reduce damage and improve fingerprint signals , avoid the effect of arc structure
Inactive Publication Date: 2016-09-28
POWERTECH TECH SUZHOU
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Problems solved by technology
The reason is that when the height of the wire arc is lower than 75 μm, the wire arc is too tight and the tension increases, which is easy to strain the wire arc. When the wire arc tension exceeds the extension force of the wire itself, the wire arc will break
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[0022] Such as Figure 1 ~ Figure 3 Shown: a gold wire bonding method of a fingerprint product packaging structure disclosed in this embodiment, the fingerprint product packaging structure includes: a substrate 1; a chip 2 stacked on the top surface of the substrate 1; Adhesive tape 3 is used between the chip 2 and the substrate 1; the packaging space of the package structure is filled with insulating resin 5, and the chip 2 is electrically connected to the substrate through gold wire 4 bonding technology, and the gold wire 4 The wiring method includes the following steps:
[0023] (1) After the solder balls are soldered on the pads, the ceramic nozzle releases a gold wire of about 35-45 μm along the Z direction as the base height of the wire arc; the Z direction is the vertical upward direction from the substrate to the chip; the ceramic The mouth is a capillary chopper;
[0024] The gold wire released vertically can minimize the damage of the porcelain nozzle to the gold w...
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The invention discloses a gold thread routing method for a fingerprint product packing structure. The finger product packaging structure includes: one substrate; one chip which is stacked on a top surface of the substrate; the chip and the substrate are adhered by a tape; a packaging space of the packaging structure is filled with an insulating resin, and the chip is in electrical connection to the substrate by a gold thread bonding technology. According to the invention, the method, compared with prior art, has the following advantages: the method employs multiple routing stages, and at each routing stage, routing is precisely controlled, and after proper routing of the first 4 stages, height and strength control is conducted at the later 2 stages, so that the method can effectively reach a super-low arc height which is lower than 60 [mu]m, and no crack or damage will occur, and effectively acquires better fingerprint signals.
Description
technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a gold wire bonding method for a fingerprint product packaging structure. Background technique [0002] In the field of fingerprint identification packaging, in order to obtain better fingerprint signals, the height of the gold wire arc must be controlled below 60 μm. Traditional semiconductor packaging uses gold wires for chip functional connections, and the arc height of conventional wire bonding processes needs to be controlled above 75 μm. The reason is that when the wire arc height is lower than 75 μm, the wire arc is too tight and the tension increases, which is easy to strain the wire arc. When the wire arc tension exceeds the extension force of the wire itself, the wire arc will break. Contents of the invention [0003] The purpose of the present invention is to provide a gold wire bonding method for the packaging structure of fingerprint products, w...
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IPC IPC(8): H01L21/60
CPCH01L24/78H01L24/85H01L2224/78308H01L2224/85186H01L2224/73265
Inventor 倪俊阳
Owner POWERTECH TECH SUZHOU