Level adjusting apparatus of substrate processing apparatus and level adjusting method using the same

A technology of a substrate processing device and a level adjustment device, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of different levels of level adjustment, difficulty in achieving small adjustments, and low accuracy of level adjustments. Adjustment effect

Active Publication Date: 2016-10-05
TES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is manually operated, so there is a problem that the degree of level adjustment varies depending on the operator's proficiency and work technique.
In addition, in the above-mentioned conventional method, manual adjustment is directly performed by an operator, so there is a problem that it is difficult to realize fine adjustment, and furthermore, the accuracy of horizontal adjustment is very low.

Method used

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  • Level adjusting apparatus of substrate processing apparatus and level adjusting method using the same
  • Level adjusting apparatus of substrate processing apparatus and level adjusting method using the same
  • Level adjusting apparatus of substrate processing apparatus and level adjusting method using the same

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Embodiment Construction

[0031] Hereinafter, with reference to the accompanying drawings, various embodiments of the level adjusting device of the present invention will be observed in detail.

[0032] figure 1 The level adjustment device 100 which shows an embodiment of the present invention is equipped with a schematic diagram below the chamber 12, figure 2 is a perspective view of the level adjustment device 100 . exist figure 1 In the description of the connection structure of the chamber 12 , the support plate 40 , the support rod 30 , the crystal seat 16 and so on, it has been described in detail in the background art, so repeated description is omitted.

[0033] refer to figure 1 and figure 2 , the level adjustment device 100 may include: a first adjustment unit 102, which moves the support plate 40 up and down by a certain distance; and a second adjustment unit 104, which prevents the support plate 40 from negative pressure and move upward.

[0034] That is, the first adjustment uni...

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Abstract

The invention relates to a level adjusting apparatus of a substrate processing apparatus and a level adjusting method using the same. The level adjusting apparatus is an apparatus disposed below a cavity and used for adjusting level of a support plate connected to a crystal base for mounting a substrate. The level adjusting apparatus is characterized by including a first adjusting unit to allow the support plate to move up and down by a specific distance and a second adjusting unit preventing upward movement of the support plate due to negative pressure in the cavity. The level adjusting apparatus and the method using the same can accurately, simply and conveniently adjust the level of the support plate.

Description

technical field [0001] The invention relates to a level adjustment device of a substrate processing device and a level adjustment method using the same. Background technique [0002] In the case of forming a thin film on a substrate such as a semiconductor wafer (hereinafter referred to as "substrate"), a chamber with a specific space formed inside is provided with a wafer seat on which the substrate is mounted, and a supply device is provided above the chamber. A gas supply unit for various process gases and / or purge gases is used to vapor-deposit thin films on the substrate. [0003] Figure 12 A thin-film vapor deposition apparatus 10 having a conventional level adjustment apparatus is shown. refer to Figure 12 A gas supply unit 14 and a wafer base 16 on which the substrate W is mounted are provided inside the chamber 12 , and an extension portion 18 extending downward from the wafer base 16 is connected to a lower lifting plate 20 . In this case, the lifting plate 20 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67005H01L21/67011H01L21/68H01L21/683
Inventor 尹炳浩张琼镐盧熙成崔落句全商熙
Owner TES CO LTD
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