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Optical assemblies including dry adhesive layers and associated methods

A technology for dry adhesives and optical components, which is applied in electrical components, electrical solid devices, semiconductor devices, etc., and can solve the problems that optical components cannot meet performance targets

Active Publication Date: 2016-10-05
OMNIVISION TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, optical assemblies 200(1) and 200(2) cannot meet performance goals and must be eliminated

Method used

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  • Optical assemblies including dry adhesive layers and associated methods
  • Optical assemblies including dry adhesive layers and associated methods
  • Optical assemblies including dry adhesive layers and associated methods

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Embodiment Construction

[0015] Applicants have discovered that differences between the expected FFL of a lens module and its actual FFL can be at least partially compensated for by one or more transparent dry adhesive layers between the lens module and the image sensor bonded thereto. The thickness of the transparent dry adhesive layer is a function of the FFL of the lens module. In particular, the thickness of the transparent dry adhesive layer is selected such that the focal point of the lens module is substantially aligned with the image plane of the image sensor when the lens assembly is bonded to the image sensor. For example, a clear dry adhesive layer for a lens module with a long FFL will have a relatively large thickness to compensate for the long FFL of the lens module. On the other hand, the transparent dry adhesive layer for a lens module with a short FFL will have a relatively small thickness to compensate for the short FFL of the lens module. Such adjustment of the thickness of the tra...

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Abstract

An optical assembly includes an image sensor, a lens module disposed over the image sensor in a first direction, a transparent glue layer, and a transparent dry adhesive layer formed of a different material than the transparent glue layer. Each of the transparent glue layer and the transparent dry adhesive layer are disposed between the image sensor and the lens module in the first direction. Each of the transparent glue layer and the transparent dry adhesive layer are optically coupled in series with the image sensor and the lens module. A method for forming an optical assembly includes joining an image sensor and a lens module using a transparent glue layer and a transparent dry adhesive layer formed of a different material than the transparent glue layer.

Description

technical field [0001] The present application relates to an optical assembly and related methods. Background technique [0002] Chip-scale technology can be used to create multiple parallel optical components. Chip-scale technology typically includes chips that form arrays of optical components, such as lens arrays or image sensor arrays. The chip can be singulated, that is, divided into sections, to separate the optical components of the array. Alternatively, the chips of two or more optical assemblies may be joined together to form a connected chip assembly, which is then singulated into multiple optical assemblies, where each optical assembly typically includes components from each Optical components of the chip. [0003] The optical components of a given array are usually designed to be identical. For example, the lenses of an on-chip lens array are typically designed to have the same properties. Often, however, due to manufacturing imperfections, there will be var...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/50H04N23/55H01L27/14625H01L31/02325H01L31/18Y02P70/50
Inventor 黄俊善张家扬
Owner OMNIVISION TECH INC