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A kind of photosensitive resin for support material and preparation method thereof

A technology of photosensitive resin and support material, which is applied in the field of photosensitive resin, can solve problems such as the limitation of photocuring 3D printing technology, achieve the effect of improving comprehensive expression, reducing cost, and meeting user needs

Active Publication Date: 2019-01-15
JIANGSU DUNCHAO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there is no such photosensitive resin for supporting materials that meets the requirements in China, and they are all monopolized by foreign countries, which greatly restricts my country's light-curing 3D printing technology.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1, a kind of photosensitive resin for support material, its raw material is calculated by weight percentage, is made up of the following several components:

[0026] Oligomers 41.5%

[0027] Lanolin 45%

[0028] Photoinitiator 2.5%

[0029] Reactive diluent 10%

[0030] Defoamer 0.5%

[0031] Leveling agent 0.5%

[0032] To prepare the photosensitive resin used for the supporting material in this example, use a constant temperature water bath to heat a small beaker, add oligomers and reactive diluents and stir evenly, control the temperature of the water bath to 45-55 degrees Celsius, preferably 50 degrees Celsius, add lanolin, and stir Evenly, then add the photoinitiator, defoamer and leveling agent, mix evenly, the photoinitiator used is 2.5%, the prepared photosensitive resin is tested in the photocuring 3D printer, reaching the performance of foreign products index.

Embodiment 2

[0033] Embodiment 2, a photosensitive resin used for solid materials, its raw materials are composed of the following components in terms of weight percentage:

[0034] Oligomer 47%

[0035] Lanolin 35%;

[0036] Photoinitiator 2%;

[0037] Active diluent 15%;

[0038] Defoamer 0.5%

[0039] Leveling agent 0.5%

[0040] To prepare the photosensitive resin used for the supporting material in this example, use a constant temperature water bath to heat a small beaker, add oligomers and reactive diluents and stir evenly, control the temperature of the water bath to 45-55 degrees Celsius, preferably 50 degrees Celsius, add lanolin, and stir Evenly, then add the photoinitiator, defoamer and leveling agent, mix evenly, the photoinitiator used is 2%, the prepared photosensitive resin is tested in the photocuring 3D printer, reaching the performance of foreign products index.

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Abstract

The invention discloses a photosensitive resin used in supporting materials, and a preparation method thereof. The photosensitive resin comprises 20-50wt% of oligomer, 20-45wt% of a low temperature phase change substance, 1-5wt% of a photoinitiator, 10-15wt% of an active diluent, 0.1-2wt% of an antifoaming agent and 0.1-2wt% of a leveling agent. The preparation method of the photosensitive resin comprises the following steps: 1, preparing raw materials according to above proportions; and 2, uniformly mixing all components to prepare the photosensitive resin material used in supporting material printing and having a viscosity of 10-15 centipoises. An inkjet UV cure molding technology can remove a UV cured material, and jelly-shaped resin with certain supporting ability and being different models is formed after same-intensity ultraviolet irradiation. The photosensitive resin can be used as a model supporting and model filling material of the UV cure molding technology, and can be removed through using water or other methods in the model post-treatment process.

Description

technical field [0001] The invention relates to a photosensitive resin that can be used as a support material, in particular to a photosensitive resin used as a support material for a photocurable 3D printer, and belongs to the technical field of photocurable materials. Background technique [0002] The current market-circulating 3D printing inkjet UV curing molding process is to spray out UV-curable photosensitive resin with inkjet method, cure it by UV light irradiation, and then superimpose layer by layer to form the required model. Since the model has The suspended part and the hollow part, so the inkjet printed UV curable photosensitive resin material is divided into solid material and support material. The solid material prints out the model entity, and the support material prints the suspended part of the model and the hollow part of the model. After the model is printed, After rinsing with hot water or other materials, the support material is removed, revealing the h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L91/00C08L91/06C08L33/04C08L35/02C08F220/28C08F220/34C08F220/18C08F222/14C08F222/20
CPCC08F220/18C08F220/28C08F220/281C08F220/285C08F220/286C08F220/34C08F220/343C08F222/14C08F222/145C08F222/20C08L33/04C08L35/02C08L91/00C08L91/06C08F220/22
Inventor 曾皖生乔羽谭诚
Owner JIANGSU DUNCHAO ELECTRONICS CO LTD
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