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LED support, LED and LED packaging process

A technology of LED bracket and sealing glue, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of increasing the luminous angle of LED lamp beads, increasing material and labor costs, LED lamp bead vulcanization failure, etc., to achieve the increase of luminous angle , Increase the effect of reflection angle

Inactive Publication Date: 2016-11-16
湖南普斯赛特光电科技有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This greatly increases the cost of materials and labor, so how to effectively increase the luminous angle of LED lamp beads and overcome the failure of LED lamp beads vulcanization is a technical problem that needs to be solved urgently in the industry

Method used

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  • LED support, LED and LED packaging process
  • LED support, LED and LED packaging process
  • LED support, LED and LED packaging process

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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0026] as shown in the picture figure 1 as well as figure 2 As shown, the present invention relates to an LED bracket, which includes a pin 1 and a cup body 2, wherein the cup body is arranged on the pin, and usually the cup body and the pin 1 are integrally formed, and the preferred molding materials of the two for the PPA.

[0027] Unlike common LED bracket pins which have a planar structure, the chip placement plane in the middle of the pins in this patent is composed of an upwardly raised platform structure, and placing chips on the raised platform can increase the LED light-emitting angle, A preferred forming method for the raised platform structure is punching from the back of the bracket. The cup body is arranged on the pins and fills the gap between the pins to form a bowl-cup structure.

[0028] The present invention also provid...

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Abstract

The invention discloses an LED support, an LED comprising the support and an LED packaging process. The LED support comprises a base pin and a cup body. The cup body is arranged on the base pin; the middle place of the base pin is provided with an upwardly-raised chip placing platform; the plane height of the chip placing platform is slightly smaller than the height of the upper surface of the cup body or equal to or larger than the height of the upper surface of the cup body; since the base pin adopts the upwardly-raised chip placing platform structure, light ray reflection angle of the packaged LED is increased due to the raised chip placing platform structure, the LED light-emitting angle is allowed to be increased greatly, and in the later LED packaging process, epoxy resin colloid and silica gel can be adopted for packaging to form the LED; and the epoxy resin colloid is filled between the raised chip placing platform and the bowl cup, so that a silver-plated layer can be effectively protected from being vulcanized.

Description

technical field [0001] The invention relates to an LED structure and a packaging process, in particular to an LED bracket, an LED and an LED packaging process. Background technique [0002] At present, in the field of lighting, after LED production is packaged by SMD, when the product is used, due to the small light-emitting angle of the LED, it often does not reach enough illuminance space, which will cause the lamp tube or lamp board to look obvious grainy. At the same time, due to the problem that the silver-plated layer of the LED bracket is particularly easy to vulcanize during the use of the product, the problem of LED vulcanization failure is very prominent. [0003] For this reason, a method commonly used in the industry is to increase the arrangement density of the lamp beads, and at the same time, coat the lamp bead body with a layer of glue to prevent LED vulcanization failure. This greatly increases the cost of materials and labor. Therefore, how to effectively ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/56
CPCH01L33/486H01L33/54H01L33/56H01L2933/005
Inventor 宋华铸
Owner 湖南普斯赛特光电科技有限公司
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