Detection device for copper powder on matte surface of electronic copper foil and method

A detection device, electronic copper foil technology, applied in the direction of measuring device, material analysis through optical means, instrument, etc. Surface copper powder status and other issues to achieve the effect of avoiding damage

Inactive Publication Date: 2016-11-23
ANHUI TONGGUAN COPPER FOIL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantage of the weight dragging method is that the detection is only carried out in one direction of the rough surface of the copper foil, and the copper powder condition on the rough surface of the copper foil cannot be truly reflected. In addition, the 250g weight is pressed and then dragged, which is easy to damage the copper foil rough surface. Nodules, causing misjudgment of the copper powder on the rough surface of the copper foil

Method used

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  • Detection device for copper powder on matte surface of electronic copper foil and method
  • Detection device for copper powder on matte surface of electronic copper foil and method

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Combine the sticky roller with the rough surface of the copper foil at a pressure of 0.35MPa, and combine the sticky paper roll with the sticky roller at a pressure of 0.42Mpa. , transfer the copper powder on the rough surface of the copper foil to the sticky paper. After sticking the dust for 900 meters, remove the sticky paper from the sticky paper roll, and observe the condition of the copper powder on the sticky paper through a metallographic microscope to reflect the copper Condition of copper powder on foil matte side.

[0030] Sampling method according to figure 2 In the method shown, sample 5cm×5cm and 11cm-11cm-sticky paper on both sides of the sticky paper at a distance of 1-11cm from the edge line. Take a sample and observe the size and quantity of copper powder with a metallographic microscope. As a result, it is possible to avoid the destruction of nodules generated by electroplating on the matte surface of the copper foil, and to clearly and truly observ...

Embodiment 2

[0032] Combine the sticky roller with the rough surface of the copper foil at a pressure of 0.55MPa, and combine the sticky paper roll with the sticky roller at a pressure of 0.49MPa. , transfer the copper powder on the rough surface of the copper foil to the sticky paper. After sticking the dust for 900 meters, remove the sticky paper from the sticky paper roll, and observe the condition of the copper powder on the sticky paper through a metallographic microscope to reflect the copper Condition of copper powder on foil matte side.

[0033] When observing copper powder with sticky paper, the sampling method is as follows figure 2 In the method shown, sample 5cm×5cm and 11cm-11cm-sticky paper on both sides of the sticky paper at a distance of 1-11cm from the edge line. Take a sample and observe the size and quantity of copper powder with a metallographic microscope. As a result, it is possible to avoid the destruction of nodules generated by electroplating on the matte surfac...

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PUM

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Abstract

A detection device for copper powder on a matte surface of electronic copper foil comprises a guide roller, a dust sticking roller and a dust sticking paper roll, wherein the guide roller is used for guiding the copper foil; the dust sticking roller can apply pressure to the matte surface of the copper foil passing through the guide roller, is adjacent to the guide roller, and is coated with low-viscosity silica gel; the dust sticking paper roll is not contacted with the guide roller for guiding the copper foil but is contacted with the dust sticking roller and applies pressure to the dust sticking roller. According to the detection device, damage to nodules generated on the matte surface of the electronic copper foil through electroplating can be avoided, and the status of the copper powder on the matte surface of the whole copper foil can be reflected truly.

Description

technical field [0001] The invention relates to a detection device and method for copper powder on the rough surface of electronic copper foil. Background technique [0002] At present, the detection method of copper powder on the rough surface of copper foil generally adopts the method of dragging with weights. This method only tests one direction of the latitudinal or radial direction of copper foil, and when dragging with weights, it is easy to remove the nodules formed by electroplating on the rough surface of copper foil. material damage, it cannot truly reflect the condition of the copper powder on the rough surface of the entire copper foil, [0003] During the production process of the new high-precision electronic copper foil and the cutting process of the slitting machine, copper powder is attached to the rough surface of the copper foil. The circuit is broken down or short-circuited during post-processing, which seriously affects the quality of the product. [0...

Claims

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Application Information

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IPC IPC(8): G01N21/84
CPCG01N21/84
Inventor 丁士启于君杰郑小伟贾金涛李大双汪光志
Owner ANHUI TONGGUAN COPPER FOIL
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