Interconnected back plate

A backplane and board part technology, applied in the field of electronic equipment, can solve the problem that the backplane cannot meet more wiring requirements, and achieve the effect of meeting the wiring requirements, increasing the wiring area, and realizing electrical connection

Inactive Publication Date: 2016-11-30
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide an interconnected backplane, which aims to solve the technical problem that the existing backplane cannot meet more wiring requirements

Method used

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  • Interconnected back plate
  • Interconnected back plate
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Examples

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Embodiment Construction

[0022] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] The present invention provides an interconnected backplane for installing circuit boards, referring to Figure 1 to Figure 3 In one embodiment, the interconnected backplane includes a first backplane unit 100 and a second backplane unit 200 stacked with the first backplane unit 100, and the first backplane unit 100 faces the second backplane unit 100. The surface of the second backplane unit 200 is provided with several first plug-in parts 120, and the surface of the second backplane unit 200 facing the first backplane unit 100 is provided with several first plug-in parts 120. The second plug-in part 220 is compatible, the first plug-in part 120 is plugged into the second plug-in part 220, so that the first backplane unit 100 and the second backplane unit 200 Fixed connection. In the interconnected backplane ...

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PUM

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Abstract

The invention discloses an interconnected back plate which comprises a first back plate unit and a second back plate unit. The first back plate unit and the second back plate unit are overlaid. The surface, facing the second back plate unit, of the first back plate unit is provided with a plurality of first plugged connection portions. The surface, facing the first back plate unit, of the second back plate unit is provided with a plurality of second plugged connection portions matched with the first plugged connection portions. The first plugged connection portions and the second plugged connection portions are in plugged connection, and therefore the first back plate unit and the second back plate unit are fixedly connected. According to the interconnected back plate, due to the fact that the first plugged connection portions are arranged on the first back plate unit and the second plugged connection portions are arranged on the second back plate unit, interconnection between the first back plate unit and the second back plate unit is easily achieved, then, a circuit board installed on the first back plate unit is electrically connected with a circuit board installed on the second back plate unit, the wiring area is effectively increased, and therefore more wiring requirements are met.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to an interconnected backplane. Background technique [0002] In large-scale communication equipment, there are generally many independent PCB single boards to form a complex system. These independent PCB single boards need to be interconnected, which is generally realized through the PCB backplane. As the equipment becomes more and more complex, a plug-in There are many cases where there are PCB single boards before and after the box. With the use of high-speed connectors, the signal transmission rate of the backplane is getting higher and higher. In this way, there are more and more interconnected lines on the PCB backplane, and the number of layers of the PCB backplane There are more and more, and the thickness is getting thicker, but currently limited by the processing technology, the thickness of the PCB backplane (currently the maximum thickness is 8mm) and the nu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18H04L12/931
CPCG06F1/18
Inventor 顾建军
Owner ZTE CORP
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