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Formation method of vertical crack in substrate of brittle material and substrate breaking method

A technology of brittle material substrates and vertical cracks, applied in stone processing tools, stone processing equipment, fine working devices, etc.

Inactive Publication Date: 2020-06-23
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When a scribe line is formed, a vertical crack tends to fully propagate in the thickness direction to disconnect the substrate, however, a vertical crack sometimes propagates only locally in the thickness direction

Method used

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  • Formation method of vertical crack in substrate of brittle material and substrate breaking method
  • Formation method of vertical crack in substrate of brittle material and substrate breaking method
  • Formation method of vertical crack in substrate of brittle material and substrate breaking method

Examples

Experimental program
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Effect test

Embodiment 2

[0087] In order to investigate the relationship between the inclination direction of the scribing wheel 51 and the vertical crack VC, the VC establishment rate when the inclination angle θ was set to -1.2° was evaluated. Conditions other than the inclination angle θ are the same as in Example 1. Note that, for example, based on figure 2 For illustration, the case where the inclination angle θ is negative corresponds to the extension direction D1 of the vertical axis formed by the edge PF (peripheral portion) of the scribing wheel 51 and the perpendicular axis of the horizontal plane relative to the scribing wheel 51. figure 2 Shown is the case where the scribe direction DP is inclined in such a way that it faces the opposite side, based on image 3 For illustration, the case where the inclination angle θ is negative corresponds to the case where the forward direction of the scribing wheel 51 is inclined toward the downstream side of the formation position of the auxiliary l...

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PUM

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Abstract

Provided is a method for forming vertical cracks on a brittle material substrate at high certainty. The method comprises: a trench line forming process of forming a trench line which is a line-shaped groove part on one side main surface; and an assisting line forming process of forming an assisting line crossing the trench line by pressing, welding, and electrically driving a scribing wheel having evenly formed blade ends on the outer circumferential part thereof. According to the trench line forming process, a trench line is formed to make a crackless state is maintained right under the same. According to the assisting line forming process, an assisting line is formed in a state in which a scribing wheel is inclined at a predetermined slope angle from a formation direction of an assisting line, and extension of vertical cracks occur from the trench line by using a crossing point of both line as an initial point.

Description

technical field [0001] The present invention relates to a method for breaking a substrate of brittle material, and more particularly to a method of forming a vertical crack when breaking a substrate of brittle material. Background technique [0002] The manufacturing process of a flat panel display panel or a solar cell panel generally includes a process of breaking a substrate (mother substrate) made of a brittle material such as a glass substrate, a ceramic substrate, or a semiconductor substrate. For related breaks, a method of forming a scribe line on the surface of the substrate using a scribing tool such as a diamond burr or a cutter wheel, and causing cracks (vertical cracks) to propagate from the scribe line toward the thickness of the substrate is widely used. When scribe lines are formed, the vertical cracks often fully propagate in the thickness direction to disconnect the substrate, however, the vertical cracks sometimes propagate only locally in the thickness di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00B28D5/02B28D1/22C03B33/023
CPCB28D1/225B28D5/0011B28D5/0029B28D5/023C03B33/023C03B33/0207C03B33/027C03B33/033C03B33/037Y02P40/50
Inventor 岩坪佑磨曾山浩
Owner MITSUBOSHI DIAMOND IND CO LTD
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