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Determining contact edge roughness of a contact hole etched in a wafer

An edge roughness and hole technology, which is used in image data processing, measurement devices, instruments, etc., can solve the time-varying dielectric breakdown of circuits, affect the source/drain contact resistance and saturation current of integrated circuits, and easily contact hole edges. Unsmooth, etc.

Inactive Publication Date: 2016-12-07
MACRONIX INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the edges of contact holes tend to be uneven
The roughness of the contact hole may affect the source / drain contact resistance and saturation current of the resulting integrated circuit, and may cause time-dependent-dielectric-breakdown of the circuit

Method used

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  • Determining contact edge roughness of a contact hole etched in a wafer
  • Determining contact edge roughness of a contact hole etched in a wafer
  • Determining contact edge roughness of a contact hole etched in a wafer

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Embodiment Construction

[0039] The invention will now be described more fully hereinafter with reference to the drawings, in which some, but not all, embodiments of the invention are shown. Indeed, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. Unless otherwise specified, the word "or" is used herein in both an alternative and a conjunctive sense. The words "illustrative" and "exemplary" are examples without quality level indications. Like numbers refer to like elements throughout.

[0040] Many modifications and embodiments of the invention will come to mind to one skilled in the art having the benefit of the teachings of the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the inventions are not to be limited to the particular embodiments disclosed and that modificatio...

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PUM

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Abstract

Embodiments of the present invention provide methods, systems, apparatuses, and computer program products for determining the contact edge roughness of a contact hole etched in a wafer. One embodiment provides a method comprising acquiring image data corresponding to the hole; based at least in part on the image data, determining a hole profile; determining an ideal shape for the hole based at least in part on the hole profile; and determining the contact edge roughness based at least in part on the hole profile and ideal shape. The hole profile may be configured to describe a distance from a reference point of the contact hole to an edge of the contact hole for each of a predetermined set of angles and the ideal shape may be described by a distance from a reference point of the ideal shape to an edge of the ideal shape for each predetermined angle.

Description

technical field [0001] The present invention relates to a method of determining the contact edge roughness of a contact hole etched in a wafer. Background technique [0002] Modern electronic devices can be made of integrated circuits. An integrated circuit is an electronic circuit formed on a small piece of semiconductor material (such as silicon), often referred to as a wafer. To fabricate integrated circuits on a wafer, contact holes are etched into the wafer. The contact holes can then be filled with conductive or semiconductor material to electrically connect various components of the integrated circuit. [0003] Generally, the contact holes etched in the wafer should be circular or oval. In practice, however, contact holes are often non-circular or elliptical. In addition, the edges of the contact holes tend to be uneven. The roughness of the contact holes may affect the source / drain contact resistance and saturation current of the resulting integrated circuit, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01B15/08
CPCG06T7/0006G06T7/60G06T2207/10061G06T2207/30148G06T7/13
Inventor 郑清仁
Owner MACRONIX INT CO LTD