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Flip chip and method of forming flip chip

A flip-chip and graphics technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of differential resistance voltage drop, the flip-chip 200 is not suitable for non-uniform power domain, etc., to reduce resistance The effect of pressure drop

Active Publication Date: 2019-03-29
FORTIETH FLOOR LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

like figure 2 As shown, the conventional flip chip 200 only uses regularly staggered bumps, so the conventional flip chip 200 is not suitable for the non-uniform power domain, which results in poor resistance voltage drop

Method used

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  • Flip chip and method of forming flip chip
  • Flip chip and method of forming flip chip
  • Flip chip and method of forming flip chip

Examples

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Embodiment Construction

[0058] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0059] Certain terms are used in the description and claims of this application to refer to particular components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. "Include" and "comprising" mentioned throughout the specification and claims are open-ended terms, so they should be interpreted as "including (includi...

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Abstract

The embodiment of the invention discloses a flip chip and a method for forming the flip chip. Wherein the flip chip includes: a non-uniform power domain; and a non-uniform bump pattern formed by a plurality of bumps and matching the non-uniform power domain. Further, the first part of the plurality of bumps is arranged in a first pattern, and the second part of the plurality of bumps is arranged in a second pattern, wherein the first pattern is different from the second pattern, and the first pattern is formed by An equilateral triangle formed by three bumps, and a second figure is a square formed by four bumps. The embodiments of the present invention have the advantages of conforming to the power domain, reducing the resistance voltage drop and having the largest number of bumps in each power domain.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a flip chip (flip chip) and a method for forming a flip chip. Background technique [0002] Applications using regular inline-bumps or stagger-bumps have been disclosed and discussed in various documents. Please refer to figure 1 , figure 1 is a simplified schematic diagram of a conventional flip chip 100 . Such as figure 1 As shown, the conventional flip chip 100 only uses regular rows of bumps, so the conventional flip chip 100 is not suitable for non-uniform power domains, which results in poor IR drops. [0003] Please refer to figure 2 , figure 2 is a simplified schematic diagram of another conventional flip chip 200 . Such as figure 2 As shown, the conventional flip chip 200 only uses regularly staggered bumps, so the conventional flip chip 200 is not suitable for non-uniform power domains, thus resulting in poor resistive voltage drop. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/48
CPCH01L2224/14131H01L2224/14179H01L2224/14133H01L24/14H01L2224/14135H01L2224/14132H01L2224/14177H01L2224/14136H01L23/5283
Inventor 方家伟黄升佑
Owner FORTIETH FLOOR LLC
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