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Resin material supply device and compression molding device for compression molding device

A resin material, compression molding technology, applied in the field of electronic parts devices, can solve the problems of bad influence, disconnection, mutual contact and other problems of electronic parts

Active Publication Date: 2019-03-12
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the resin material is supplied to the lower mold in an uneven state, when the mold is closed for sealing molding, the resin material flows (resin flows from a portion where a large amount of resin is supplied to a portion where a small amount of resin is supplied) ), thereby causing adverse effects on electronic parts (for example, bonding wires are deformed and come into contact with each other, or bonding wires are disconnected, etc.)

Method used

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  • Resin material supply device and compression molding device for compression molding device
  • Resin material supply device and compression molding device for compression molding device
  • Resin material supply device and compression molding device for compression molding device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0107] For the compression molding steps of electronic parts using the first embodiment of the resin material supply device 20 of the present invention, while referring to Figure 1(a) to Figure 1(f) while explaining. The mold of the compression molding device 10 used here is composed of an upper mold 11 , a lower mold 12 , and an intermediate plate 13 , and the cavity 121 of the lower mold 12 is rectangular in plan view. In addition, the top view shape of the chamber can also be triangle, square, rhombus, ellipse, circle, etc., which can be applied without changing the present invention. The resin material supply device 20 includes a resin holding tray 21 composed of upper and lower slit plates, and a slit plate moving mechanism 22 for moving the slit plates of the resin holding tray 21 . The resin material supply device 20 will be described in detail later. In addition, although granular resin is used as the resin material in this embodiment, other forms such as powder may...

no. 2 example

[0124] For the second embodiment of the resin material supply device of the compression molding device of the present invention, while referring to Figure 5(a) to Figure 5(c) and Figure 6 while explaining. In the resin material supply device of this embodiment, the resin holding tray 50 is composed of an upper slit plate 51 and a lower slit plate 52 as in the first embodiment. The lower slit plate 52 has the same configuration as the lower slit plate 32 of the first embodiment, and has a slit 54 and a horizontal frame 56 without openings. As for the upper slit plate 51, as shown in FIG. 5(a), the height of the horizontal frame 55 is lower than the height of the frame 57 (upper position). Therefore, above the upper slit plate 51, a large space 58 surrounded by the frame 57 is formed.

[0125] In the resin material supply device of this embodiment, the upper slit plate 51 functions as a resin holding plate, and the slits 53 of the upper slit plate 51 and the spaces 58 above ...

no. 3 example

[0131] Regarding the third embodiment of the resin material supply device of the compression molding device of the present invention, while referring to Figure 7(a) to Figure 7(d) while explaining. The resin material supply device of this embodiment includes a plate-shaped resin tray 61 in which rectangular openings 62 are arranged two-dimensionally, and a plate-shaped shutter 66 of the same size as that provided on the lower surface thereof. The plurality of openings 62 are partitioned by a horizontal frame 63 , and the horizontal frame 63 has a mountain-shaped cross-sectional shape at its upper portion as shown in FIG. 7( b ). The cross-sectional shape of the horizontal frame 63 may be a semicircular upper part as shown in FIG. 7( c ), or a triangular shape as in the first embodiment as shown in FIG. 7( d ). In addition, the planar shape of the opening may be a rectangle, a triangle, a rhombus, a circle, an ellipse, or the like. For example, in Figure 8(a) to Figure 8(c...

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Abstract

Provided is a resin material supply device of a compression molding device. The resin material supply device can uniformly supply a resin material to a cavity, and does not dirt the surroundings of the compression molding device or hinder a normal operation. The resin material supply device comprises: a top slit plate (31) having a plurality of resin maintenance slits (33); and a bottom slit plate (32) for closing and opening the resin maintenance slits (33). A plane part is not included in the top of bars between the resin maintenance slits (33). Accordingly, when a resin material is added in the resin maintenance slits (33), the resin material is not put on the top of the bar (35). When the resin material is supplied to a cavity from the resin maintenance slits (33), a residual resin material is not supplied to the cavity. Thus, a schedules uniform supply is performed. Moreover, when the resin material supply device is disposed on the cavity or is removed therefrom, a resin material does not even fall, so the surroundings of the compression molding device is not dirted or a normal operation is not hindered.

Description

technical field [0001] The present invention relates to a device for sealing electronic parts such as semiconductor chips with resin, and more particularly to a device for supplying granular or powdery resin materials (hereinafter, these are collectively referred to as "resin materials") for compression molding. A device to the cavity of a mold, and a compression molding device. Background technique [0002] With the miniaturization of electronic components and the corresponding reduction in the diameter of bonding wires such as semiconductor chips, compression molding is gradually used in the sealing and molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a mold release film, and after heating and melting, the resin is compressed by closing the mold between upper molds on which substrates with electronic components are mounted. Forming is thus performed. In the above-mentioned compression molding,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C43/34B29C43/18H01L21/56
Inventor 尾张弘树高田直毅大庭亮人
Owner TOWA