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Resin material supply device of compression moulding device and compression moulding device

A resin material, compression molding technology, applied in the field of electronic parts devices, can solve problems such as adverse effects, disconnection, and mutual contact of electronic parts

Active Publication Date: 2016-12-21
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the resin material is supplied to the lower mold in an uneven state, when the mold is closed for sealing molding, the resin material flows (resin flows from a portion where a large amount of resin is supplied to a portion where a small amount of resin is supplied) ), thereby causing adverse effects on electronic parts (for example, bonding wires are deformed and come into contact with each other, or bonding wires are disconnected, etc.)

Method used

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  • Resin material supply device of compression moulding device and compression moulding device
  • Resin material supply device of compression moulding device and compression moulding device
  • Resin material supply device of compression moulding device and compression moulding device

Examples

Experimental program
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Effect test

no. 1 example

[0107] For the compression molding steps of electronic parts using the first embodiment of the resin material supply device 20 of the present invention, while referring to Figure 1(a) to Figure 1(f) while explaining. The mold of the compression molding device 10 used here is composed of an upper mold 11 , a lower mold 12 , and an intermediate plate 13 , and the cavity 121 of the lower mold 12 is rectangular in plan view. In addition, the top view shape of the chamber can also be triangle, square, rhombus, ellipse, circle, etc., which can be applied without changing the present invention. The resin material supply device 20 includes a resin holding tray 21 composed of upper and lower slit plates, and a slit plate moving mechanism 22 for moving the slit plates of the resin holding tray 21 . The resin material supply device 20 will be described in detail later. In addition, although granular resin is used as the resin material in this embodiment, other forms such as powder may...

no. 2 example

[0124] For the second embodiment of the resin material supply device of the compression molding device of the present invention, while referring to Figure 5(a) to Figure 5(c) and Image 6 while explaining. In the resin material supply device of this embodiment, the resin holding tray 50 is composed of an upper slit plate 51 and a lower slit plate 52 as in the first embodiment. The lower slit plate 52 has the same configuration as the lower slit plate 32 of the first embodiment, and has a slit 54 and a horizontal frame 56 without openings. As for the upper slit plate 51, as shown in FIG. 5(a), the height of the horizontal frame 55 is lower than the height of the frame 57 (upper position). Therefore, above the upper slit plate 51, a large space 58 surrounded by the frame 57 is formed.

[0125] In the resin material supply device of this embodiment, the upper slit plate 51 functions as a resin holding plate, and the slits 53 of the upper slit plate 51 and the spaces 58 above t...

no. 3 example

[0131] Regarding the third embodiment of the resin material supply device of the compression molding device of the present invention, while referring to Figure 7(a) to Figure 7(d) while explaining. The resin material supply device of this embodiment includes a plate-shaped resin tray 61 in which a rectangular opening 62 is arranged two-dimensionally, and a plate-shaped shutter 66 of the same size as that provided on the lower surface thereof. The plurality of openings 62 are partitioned by a horizontal frame 63 , and the horizontal frame 63 has a mountain-shaped cross-sectional shape at its upper portion as shown in FIG. 7( b ). The cross-sectional shape of the horizontal frame 63 may be a semicircular upper part as shown in FIG. 7( c ), or a triangular shape as in the first embodiment as shown in FIG. 7( d ). In addition, the planar shape of the opening may be a rectangle, a triangle, a rhombus, a circle, an ellipse, or the like. For example, in Figure 8(a) to Figure 8(c...

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Abstract

The invention provides a resin material supply device of a compression moulding device and a compression moulding device. The resin material supply device can uniformly supply a resin material into a cavity without polluting the surroundings or impeding the normal operation. The resin material supply device comprises an upper slit plate (31) comprising a plurality of resin holding slits (33) and a lower slit plate (32) for locking / opening the resin holding slits (33). The upper parts of cross racks (35) arranged between the resin holding slits do not have any flat part. When a resin material is filled into the resin holding slits (33), the upper parts of the cross racks (35) will not hold the resin material, thus when the resin material is fed into a cavity from the resin holding slits (33), no excess resin material is filled into the cavity, and a predetermined amount of resin material is uniformly supplied to the cavity. The situation that the resin material falls down when the resin material is fed into the cavity is avoided, so the surroundings will not be polluted, and the normal operation is not impeded.

Description

technical field [0001] The present invention relates to a device for sealing electronic parts such as semiconductor chips with resin, and more particularly to a device for supplying granular or powdery resin materials (hereinafter, these are collectively referred to as "resin materials") for compression molding. A device to the cavity of a mold, and a compression molding device. Background technique [0002] With the miniaturization of electronic components and the corresponding reduction in the diameter of bonding wires such as semiconductor chips, compression molding is gradually used in the sealing and molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a mold release film, and after heating and melting, the resin is compressed by closing the mold between upper molds on which substrates with electronic components are mounted. Forming is thus performed. In the above-mentioned compression molding,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/34B29C43/18H01L21/56
CPCB29C43/34B29C43/18B29C2043/181H01L21/565
Inventor 尾张弘树高田直毅大庭亮人
Owner TOWA