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Resin material supply device and method for compression molding device, and compression molding device and method

A resin material, compression molding technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effect of reducing deviation

Active Publication Date: 2019-02-22
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the simple gate method, it is found that when the gate is opened, the resin material in the resin tray is dragged by friction with the upper surface of the gate, and the opening part (central part) tends to be less. Falling, the part (both ends) of the last opening falls more (Patent Document 1, Fig. 6(1))

Method used

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  • Resin material supply device and method for compression molding device, and compression molding device and method
  • Resin material supply device and method for compression molding device, and compression molding device and method
  • Resin material supply device and method for compression molding device, and compression molding device and method

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no. 1 example

[0095] For the compression molding procedure of electronic parts using the first embodiment of the resin material supply device 20 of the present invention, refer to Figure 1(a) to Figure 1(f) while explaining. The mold of the compression molding device 10 used here is composed of an upper mold 11 , a lower mold 12 , and an intermediate plate 13 , and the cavity 121 of the lower mold 12 is rectangular in plan view. In addition, even if the planar shape of the chamber is a triangle, a square, a rhombus, an ellipse, a circle, etc., the present invention can be similarly applied. The resin material supply device 20 includes a resin storage box 21 holding granular resin, and a shutter mechanism 22 having a shutter plate 221 disposed below the bottom plate 211 of the resin storage box 21 and a shutter moving mechanism 222 for moving the shutter plate 221. . The resin material supply device 20 will be described in detail below. In addition, in this embodiment, although granular ...

no. 2 example

[0110] A second embodiment of the resin material supply device 30 of the present invention will be described with reference to FIGS. 6( a ) and 6 ( b ). The resin material supply device of this embodiment is used when the substrate to be resin-sealed is large (therefore, the chamber is also large). Fig. 6 (a) shows the perspective view of the small base plate 311 and the small gate plate 321 and the large base plate 331 and the large gate plate 341 in the completely closed state of the resin material supply device 30, and Fig. A diagram showing the state of supplying granular resin in the resin storage box.

[0111] The resin material supply device of the present embodiment is provided with a first resin material supply part comprising a small resin storage box and a small gate mechanism, and a second resin material supply part comprising a large resin storage tank and a large gate mechanism, further comprising the first The resin supply part moves on the second resin supply ...

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Abstract

Provided is a device for supplying a resin material of a compression molding device, wherein the device for supplying a resin material can reduce a deviation caused by a position of a resin material supplied into a cavity. The device (20) for supplying a resin material according to the present invention is disposed in the top of a cavity in a bottom shape of a compression molding device, and supplies a resin material to the cavity. The device (20) comprises: a resin accommodating case (21) having a bottom plate (211) having a plurality of resin supply holes (213) formed to be uniformly distributed in a two-dimensional shape; and a shutter tool (22) for closing and opening the resin supply holes (213). When a resin material is supplied to a cavity from the device (20), ridges and furrows of the resin material are uniformly distributed in a two-dimensional shape. Also, three or more ridges surround the furrows, so a height difference of ridges and furrows is low and the distribution of the resin material is similar to a plane state.

Description

technical field [0001] The present invention relates to a device for resin-sealing electronic components such as semiconductor chips, and more particularly to a device for supplying granular and powdery resin materials (hereinafter, they will be simply referred to as "resin materials") to the cavity of a mold. A resin material supply device and method for performing compression molding in a chamber, and a compression molding device and method having the resin material supply device. Background technique [0002] With the miniaturization of electronic components and the corresponding reduction in the diameter of bonding wires such as semiconductor chips, the industry has gradually adopted compression molding for the sealing and molding of electronic components. In compression molding, a resin material is supplied to the cavity of a lower mold covered with a mold release film, heated and melted, and then the resin is compressed by closing the mold with the upper mold on which ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C43/34B29C43/18H01L21/56
CPCB29C43/18B29C43/34B29C2043/181H01L21/565H01L21/566H01L2224/48091H01L2224/97H01L2924/181H01L2924/00014H01L2924/00012B29C33/0061B29C2037/90B29C2043/5833B29C2043/5875
Inventor 尾张弘树高田直毅白泽贤典
Owner TOWA