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A kind of chassis and cooling device

A chassis and heat dissipation technology, applied in the computer field, can solve problems such as hardware temperature rise and affecting hardware working performance, etc.

Active Publication Date: 2019-02-15
GUANGDONG INSPUR BIG DATA RES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Each hardware in the chassis will emit heat when the server is running. When the server runs for a long time, the heat inside the chassis cannot be discharged from the chassis in time, and heat will accumulate around the hardware inside the chassis, which will cause the temperature of the hardware itself to rise. affect hardware performance

Method used

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  • A kind of chassis and cooling device
  • A kind of chassis and cooling device
  • A kind of chassis and cooling device

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Embodiment Construction

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0050] like figure 1 As shown, the embodiment of the present invention provides a chassis, including:

[0051] The first expansion chamber 101, the first contraction chamber 102 and the second expansion chamber 103;

[0052] The first expansion chamber 101 is connected to the first contraction chamber 102;

[0053] The first contraction chamber 102 i...

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Abstract

The invention provides a case and a heat dissipation device. The case comprises a first expansion cavity, a first retraction cavity and a second expansion cavity, wherein the first expansion cavity is connected with the first retraction cavity; the first retraction cavity is connected with the second expansion cavity; the first expansion cavity is used for accommodating a fan module; the second expansion cavity is used for accommodating hardware to be subjected to heat dissipation; the case promotes heat dissipation air flow output from the fan module to enter the first retraction cavity from the first expansion cavity, the heat dissipation air flow enters the second expansion cavity after being accelerated by the first retraction cavity, and the hardware to be subjected to heat dissipation in the second expansion cavity is subjected to heat dissipation. The heat dissipation capability of the case can be improved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a case and a cooling device. Background technique [0002] With the development of information technology, the server needs to process more and more data. In order to process a large amount of data, the server needs to run for a long time. [0003] The hardware in the chassis will emit heat when the server is running. When the server runs for a long time, the heat inside the chassis cannot be discharged from the chassis in time, and heat will accumulate around the hardware inside the chassis, which will cause the temperature of the hardware itself to rise. affect the performance of the hardware. Contents of the invention [0004] Embodiments of the present invention provide a chassis and a heat dissipation device, which can improve the heat dissipation capability of the chassis. [0005] In a first aspect, an embodiment of the present invention provides a chassis, including...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 张文昌
Owner GUANGDONG INSPUR BIG DATA RES CO LTD
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