A multi-mode integrated circuit packaging device
A packaging device and integrated circuit technology, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems of difficult disassembly and complex positioning process of integrated circuit packaging, and achieve the effect of easy disassembly, easy operation and simple fixing method
Active Publication Date: 2018-12-07
徐州智方联电子科技有限公司
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Problems solved by technology
[0003] When the integrated circuit board is packaged, it needs to be positioned, and then packaged and sealed to ensure the stable operation of the electronic components. The existing integrated circuit package has a complicated positioning process, and is usually fixed by dispensing, which is not easy to disassemble.
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[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0024] like Figure 1-8 As shown, a multi-mode integrated circuit packaging device includes a packaging device bottom unit 1, a packaging device cover 2, a sealing ring 4, a fixing buckle 3 and an integrated circuit fixing unit 5, wherein the packaging device bottom unit 1 is located in the multi-mode integrated circuit package At the bottom of the device, the packaging device cover 2 is mounted on the upper part of the packaging device bottom unit 1, a sealing ring 4 is arranged between the packaging device bottom unit 1 and the packaging device cover 2, and the fixing buckle 3 is arranged on the multi-mode integrated circuit packaging device On both sides of the packaging device bottom unit 1, the packaging device cover 2 and the sea...
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The invention discloses a multi-mode integrated circuit packaging device, which includes a bottom unit of the packaging device, a cover of the packaging device, a sealing ring, a fixing buckle and an integrated circuit fixing unit, wherein the bottom unit of the packaging device is located at the bottom of the multi-mode integrated circuit packaging device The packaging device cover is installed on the upper part of the packaging device bottom unit, a sealing ring is arranged between the packaging device bottom unit and the packaging device cover, and the fixing buckles are arranged on both sides of the multi-mode integrated circuit packaging device, and the packaging device bottom unit, The packaging device cover and the sealing ring are tightly fixed together, the integrated circuit fixing unit is installed at the bottom of the packaging device bottom unit, and the integrated circuit is fixedly installed on the integrated circuit fixing unit. The integrated circuit board package of the present invention uses four fixing units to fix the integrated circuit board, and the fixing is detachable. The fixing method is not only simple and easy to carry out, but also easy to disassemble and maintain.
Description
Technical field: [0001] The invention relates to the technical field of integrated circuit board packaging, in particular to a multi-mode integrated circuit packaging device. Background technique: [0002] With the continuous development of various industries such as aerospace, aviation, machinery, light industry, and chemical industry, the whole machine is also changing in the direction of multi-function and miniaturization. In this way, the integration level of integrated circuits is required to be higher and higher, and the functions are more and more complex. Correspondingly, it is required that the packaging density of integrated circuits is increasing, the number of leads is increasing, the volume is getting smaller, the weight is getting lighter, and the replacement is getting faster and faster. The rationality and scientificity of the packaging structure will directly affect quality of integrated circuits. [0003] When the integrated circuit board is packaged, it ...
Claims
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IPC IPC(8): H01L23/31H01L23/367H01L23/473
Inventor 李风浪李舒歆
Owner 徐州智方联电子科技有限公司