Abnormity recovery method for semiconductor vertical furnace equipment
A technology for equipment abnormality and abnormal recovery, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as lack of abnormal recovery mechanisms
Active Publication Date: 2017-02-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0007] However, the exception recovery mechanism is relatively scarce. Therefore, the industry urgently needs an advanced and reliable exception recovery mechanism. Specifically, a set of exception recovery mechanism suitable for the operation of semiconductor equipment to process materials and restore equipment
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[0038] Embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the invention can have various changes in different examples without departing from the scope of the invention, and that the descriptions and illustrations therein are illustrative in nature rather than limiting the invention.
[0039] Attached below Figure 1-6 , the specific embodiment of the present invention will be further described in detail.
[0040] It should be noted that the method for restoring the state of the semiconductor device software after the restart of the present invention is suitable for a system including an information storage module and a control unit of the semiconductor device. In the above-mentioned system, the information storage module and the control unit can be realized by hardware, software, or a combination of software and hardware. In this embodiment, the above-mentioned unit...
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The invention provides an abnormity recovery method for semiconductor vertical furnace equipment. The abnormity recovery method comprises the steps of performing initialization configuration on carrier and wafer information according to attribute hierarchical structure of each module of the semiconductor vertical furnace equipment; in a technological process, updating attribute information of respective modules of all the semiconductor vertical furnace equipment of an information storage module; meanwhile, performing associated transmission and recoding of all wafer carriers of each module, and recording files of all wafer information in each wafer carrier; and if the semiconductor vertical furnace equipment suffers from an abnormal state, enabling a control module to determine the state information of all wafer carriers determined by the recording files, the state information of all wafers in each wafer carrier, and the state information of each module of the semiconductor vertical furnace equipment, and starting a processing flow of an abnormity recovery mechanism according to an abnormity recovery rule so as to protect materials (wafers and wafer carriers) in the equipment to the highest extent in order to ensure that abnormity recovery can be realized on any abnormal conditions.
Description
technical field [0001] The invention relates to the technical field of factory automation (Factory Automation) of semiconductor equipment, in particular to a method for abnormal recovery and material protection of semiconductor vertical furnace equipment. Background technique [0002] Semiconductor vertical furnace equipment is one of the important process equipment in the pre-process of semiconductor production line. It is used for diffusion, oxidation, annealing, alloying and sintering processes in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers. [0003] As wafer sizes continue to increase, chipmakers can make more chips on a single wafer. Since 2000, the wafer standard in the semiconductor industry has been set at 300 mm. [0004] To simplify transport and minimize the risk of contamination, chipmakers use "front-opening standard wafer cassettes", so-called FOUPs, to handle wafers. Each ...
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IPC IPC(8): H01L21/67
CPCH01L21/67011
Inventor 黄扬君周法福肖托刘耀琴
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD