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A Partial Wave Soldering Process for Electronic Circuit Board

A technology for electronic circuit boards and wave soldering, which is used in printed circuits, printed circuit manufacturing, and assembling printed circuits with electrical components. Good stability and strong cleaning effect

Active Publication Date: 2019-04-09
佛山市国立光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If it is not properly controlled, it is easy to cause technical problems such as unsafe welding products, poor quality, many defects, and poor stability

Method used

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  • A Partial Wave Soldering Process for Electronic Circuit Board
  • A Partial Wave Soldering Process for Electronic Circuit Board
  • A Partial Wave Soldering Process for Electronic Circuit Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A partial wave soldering process for an electronic circuit board, comprising the following steps:

[0033] (1) Divide the welding surface of the electronic circuit board to be welded into a surface mount device area and a plug-in area, and a dividing line with a width of 1-2mm is set between the two areas;

[0034] (2) The electronic circuit board to be welded is sent into the device coated with flux by the automatic controller, and the spraying range of the flux is limited so that the flux is only sprayed on the plug-in area of ​​the electronic circuit board;

[0035] Wherein, the flux used is made up of the following components by weight:

[0036] 10 parts of citric acid, 8 parts of sulfamic acid,

[0037] 0.05 parts of benzotriazole, 30 parts of ethanol,

[0038] 0.1 part of nano silicon dioxide of silanization;

[0039] (3) The electronic circuit board after spraying and cleaning is sent into the preheater, and preheated for 200s at 60°C;

[0040] (4) Send the p...

Embodiment 2

[0046] A partial wave soldering process for an electronic circuit board, comprising the following steps:

[0047] (1) Divide the welding surface of the electronic circuit board to be welded into a surface mount device area and a plug-in area, and a dividing line with a width of 1-2mm is set between the two areas;

[0048] (2) The electronic circuit board to be welded is sent into the device coated with flux by the automatic controller, and the spraying range of the flux is limited so that the flux is only sprayed on the plug-in area of ​​the electronic circuit board;

[0049] Wherein, the flux used is made up of the following components by weight:

[0050] 20 parts of citric acid, 17 parts of sulfamic acid,

[0051] 0.35 parts of benzotriazole, 40 parts of ethanol,

[0052] 0.3 part of nano silicon dioxide of silanization;

[0053] (3) The electronic circuit board after spraying and cleaning is sent into the preheater, and preheated for 100s at 90°C;

[0054] (4) Send the ...

Embodiment 3

[0059] A partial wave soldering process for an electronic circuit board, comprising the following steps:

[0060](1) Divide the welding surface of the electronic circuit board to be welded into a surface mount device area and a plug-in area, and a dividing line with a width of 1-2mm is set between the two areas;

[0061] (2) The electronic circuit board to be welded is sent into the device coated with flux by the automatic controller, and the spraying range of the flux is limited so that the flux is only sprayed on the plug-in area of ​​the electronic circuit board;

[0062] Wherein, the flux used is made up of the following components by weight:

[0063] 14 parts of citric acid, 10 parts of sulfamic acid,

[0064] 0.1 parts of benzotriazole, 33 parts of ethanol,

[0065] 0.15 parts of silanized nano silicon dioxide;

[0066] (3) The electronic circuit board after spraying and cleaning is sent into the preheater, and it is preheated for 120s at 70°C;

[0067] (4) Send the ...

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PUM

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Abstract

The invention discloses a partial wave soldering process for an electronic circuit board. The partial wave soldering process comprises the following steps of providing a to-be-soldered electronic circuit board, wherein the soldering surface of the electronic circuit board is divided into a surface mounting device region and a plug-in region; sending the to-be-soldered electronic circuit board into an apparatus coated with a soldering flux, and limiting the spraying range of the soldering flux to enable the soldering flux only to spray the plug-in region of the electronic circuit board, and then cleaning the region, sprayed with the soldering flux, on the electronic circuit board; sending the cleaned electronic circuit board into a preheater at a temperature of 60-90 DEG C, and performing pre-heating for 100-200s; sending the pre-heated electronic circuit board into a wave soldering material groove to be welded, partially covering the wave soldering material in the welding process to limit the soldering range of the wave soldering and to enable the wave soldering only to solder the plug-in region in the electronic circuit board; and cooling and cleaning the welded electronic circuit board. The welded electronic circuit board by the method is good in quality and excellent in stability.

Description

Technical field: [0001] The invention relates to a soldering process for electronic components, in particular to a partial wave soldering process for an electronic circuit board. Background technique: [0002] Wave soldering is to make the soldering surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains a slope, and a special device makes the liquid tin form a wave-like phenomenon, so it is called "wave soldering". The main material is solder bar. As people's awareness of environmental protection increases, there is a new welding process for wave soldering. The previous ones used tin-lead alloys, but lead is a heavy metal that does great harm to the human body. So the lead-free process was promoted, using "tin-silver-copper alloy" and special flux, and the soldering temperature required a higher preheating temperature. [0003] Wave soldering technology is widely used an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3447H05K2203/04
Inventor 李风浪李舒歆
Owner 佛山市国立光电科技有限公司