A spatial diffraction spectrum imaging device of a semiconductor laser array

Abstract

The invention provides a spatial diffraction spectral imaging device for a semiconductor laser array, comprising, according to the scheme, a laser, a first crevice diaphragm, a second crevice diaphragm, a first spherical lens, a second spherical lens, a beam splitter, a blazed grating, a detector and an absorption cell; a laser beam emitted by the laser passes sequentially through the two crevice diaphragms in a group and the spherical lens and enters the beam splitter, the laser beam projected through the beam splitter propagates along X axis to the blazed grating, and the laser beam reflected by the beam splitter propagates along Y axis to the absorption cell; the diffracted beam projected through the beam splitter returns to the beam splitter along an optical path, is reflected by the beam splitter, propagates along the Y axis through the second spherical lens and then propagates to the detector. Diffraction spectral spatial imaging is achieved herein for the semiconductor laser array; the optical path is shortened through 180-degree reflection of the diffracted beam and reflection by the beam splitter; the spatial diffraction spectral imaging device has the advantages that the imaging device has compact structure, and an imaging system is simple and easy to mount and adjust.

Description

technical field [0001] The invention relates to the application field of semiconductor laser technology, in particular to a spectral imaging device of a semiconductor laser array. Background technique [0002] Due to the advantages of high electro-optic conversion efficiency, good reliability, and miniaturization, semiconductor lasers are widely used in direct applications and laser pump sources, especially as pump sources for solid-state lasers and fiber lasers, which promotes the development of all-solid-state lasers. rapid development. High-beam quality, high-brightness, and high-power semiconductor laser pump sources are important basic conditions for fiber lasers and solid-state lasers to achieve high-power, high-efficiency output. [0003] As an important process of laser manufacturing, semiconductor laser chip packaging technology is an important limiting factor for the application of high-power semiconductor lasers. Its quality seriously affects the output character...

AI Technical Summary

Problems solved by technology

At present, there are micro-photocurrent spectroscopy, photocurrent spectroscopy, and micro-curved Raman spectroscopy, etc., for the measurement of strain caused by packaging. The difficulty of these methods is that they require sophisticated and expensive measurement equipment, and they also have high requirements for testing technology.

Images