Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wearable cooling vest with semiconductor refrigeration

A semiconductor and wearable technology, applied in the direction of temperature control, non-electric variable control, control/regulation system, etc., it can solve the problem that the temperature cannot be adjusted portable, the wearable vest cannot meet the requirements of small size, small weight, low noise, and cannot automatically adjust the temperature. and other problems, to achieve the effect of maintaining human work efficiency, controlling noise, and reducing the volume of the system

Active Publication Date: 2018-07-10
武汉子和成服饰有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention solves the problem that the current wearable vest cannot meet the needs of small volume, small weight and low noise; it cannot automatically adjust temperature according to the needs of the human body; To solve the problem of human body temperature adjustment, a semiconductor cooling wearable cooling vest is provided

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wearable cooling vest with semiconductor refrigeration
  • Wearable cooling vest with semiconductor refrigeration
  • Wearable cooling vest with semiconductor refrigeration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to further understand the content, features and effects of the present invention, the following examples are given, and detailed descriptions are given below with reference to the accompanying drawings.

[0032] The application principle of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0033] exist figure 1 Among them, the flexible water pipes 2 of the semiconductor cooling wearable cooling vest provided by the embodiment of the present invention are arranged and sewn on the inner surface of the elastic vest 1, and the body surface temperature collector 3 and the human heart rate collector 4 are sewn on the elastic vest 1 Close to the surface of the human skin, the flexible water pipe 2 is connected to the water circulation main line 6 through the quick joint 5, and the water circulation main line 6 is connected to the semiconductor temperature-regulating host 7 to form a refrigeration circuit. In addi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor refrigerated wearable cooling waistcoat. The semiconductor refrigerated wearable cooling waistcoat comprises a body surface temperature acquirer sewed, a human body heart rate acquirer and a semiconductor temperature adjusting mainframe, wherein the body surface temperature acquirer and the human body heart rate acquirer are sewed on the inner side of the waistcoat, the body surface temperature acquirer and the human body heart rate acquirer are respectively used for acquiring body surface characteristics of the body surface temperature of a human body and the human body heart rate and input the body surface characteristics to a central control unit of the semiconductor temperature adjusting mainframe in an electrical signal mode. The central control unit automatically performs water temperature adjustment according to the fed back human body characteristics and performs water temperature display and current display. The semiconductor temperature adjusting mainframe performs automatic heating and cooling switching through a program implanted by the central control unit. The semiconductor refrigerated wearable cooling waistcoat exposed in a heat source environment brings away human body heat through water circulation to achieve the cooling purpose and achieves the purpose of automatic circulating temperature control through real-time monitoring and feedback on the human body surface temperature, heart rate and other body surface characteristics of the human body and the predetermined program of the central control unit.

Description

technical field [0001] The invention belongs to the technical field of protection devices, and in particular relates to a semiconductor refrigeration wearable cooling vest. Background technique [0002] In a high-temperature environment, human physiological functions, especially body temperature regulation, water-salt metabolism, and blood circulation, all undergo abnormal changes. People have produced various types of human body refrigeration equipment, and liquid-cooled vests are one of them. By arranging water circulation pipelines on the surface of the human body, the cooling system adjusts the temperature of the water in the pipelines to achieve the purpose of reducing the surface temperature of the human body. At present, the technology widely used in the refrigeration system is to use air compression to cool down through the water circulation pipeline arranged in the human body, but the air compression refrigeration has problems such as large volume, heavy weight, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): A41D13/005G05D23/20
CPCA41D13/0053G05D23/2034
Inventor 李五梅戢克猛
Owner 武汉子和成服饰有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com