Ultrasonic soldering method for fast forming ceramic-metal interconnection

A technology of ultrasonic brazing and ceramic metal, which is applied in the direction of metal processing equipment, welding equipment, welding/welding/cutting items, etc., can solve the problems of low reliability, complicated process, and long cycle, so as to improve the quality of joints and simplify Connecting process, promoting improved effect

Inactive Publication Date: 2017-04-19
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to achieve the above purpose, the present invention proposes an ultrasonic brazing method for rapidly forming ceramic-metal interconnections that can overcome the problems of traditional brazing process such as long period, complex process, high cost, and low reliability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] An ultrasonic brazing method for rapidly forming ceramic-metal interconnection, comprising the following steps:

[0023] Step 1: Perform surface treatment on the base material to be interconnected, lightly grind and polish base material 1, intermediate layer 2 and base material 3 to ensure removal of oxide film and oil stains, and then place the treated specimens successively on Ultrasonic cleaning was carried out in orange oil and acetone respectively, and the cleaning time was 1~3min respectively;

[0024] Step 2: Assemble the test piece to be interconnected into a sandwich structure of base material 1 / intermediate layer / base material 3, and place it on the chopping board, wherein base material 1 is placed at the bottom;

[0025] Step 3: Heat and pressurize the structure in step 2 to melt the intermediate layer. The heating temperature is 280°C, the heating duration is 60s, and the pressurization pressure is 0.5MPa. Then apply ultrasound with an amplitude of 48μm and ...

Embodiment 2

[0030] An ultrasonic brazing method for rapidly forming ceramic-metal interconnections, comprising the following steps:

[0031] Step 1: Perform surface treatment on the base material to be interconnected, lightly grind and polish base material 1, intermediate layer 2 and base material 3 to ensure removal of oxide film and oil stains, and then place the treated specimens successively on Ultrasonic cleaning was carried out in orange oil and acetone respectively, and the cleaning time was 1~3min respectively;

[0032] Step 2: Assemble the test piece to be interconnected into a sandwich structure of base material 1 / intermediate layer / base material 3, and place it on the chopping board, wherein base material 1 is placed at the bottom;

[0033] Step 3: Heat and pressurize the structure in step 2 for a certain period of time to melt the intermediate layer. The heating temperature is 260°C, the heating duration is 40s, and the pressing pressure is 0.4MPa. Then, ultrasonic waves with ...

Embodiment 3

[0038] An ultrasonic brazing method for rapidly forming ceramic-metal interconnections, comprising the following steps:

[0039] Step 1: After the surface treatment of the interconnected base metal, lightly grind and polish the base material 1, the intermediate layer 2 and the base material 3 to ensure that the oxide film and oil stains are removed, and then place the treated specimens successively in the clear Ultrasonic cleaning is carried out in oil and acetone respectively, and the cleaning time is 1~3min respectively;

[0040]Step 2: Assemble the test piece to be interconnected into a sandwich structure of base material 1 / intermediate layer / base material 3, and place it on the chopping board, wherein base material 1 is placed at the bottom;

[0041] Step 3: Heat and pressurize the structure in step 2 for a certain period of time to melt the intermediate layer. The heating temperature is 240°C, the heating duration is 30s, and the pressing pressure is 0.3MPa. Then, ultraso...

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Abstract

The invention belongs to the technical field of welding, and particularly relates to a simple, fast and easily-implemented ultrasonic soldering method for fast forming ceramic-metal interconnection. The ultrasonic soldering method for fast forming ceramic-metal interconnection is characterized by including the following steps that surface treatment is carried out on base materials to be interconnected; then, the base materials to be interconnected are assembled into a sandwiching structure of the first base material / the middle layer / the third base material and placed on a heating table; the structure in the second step is heated and pressurized so that the middle layer can melt; and ultrasonic application is stopped, ballasting on a test piece is canceled, the test piece is taken down after the test piece is cooled, and the interconnection process is completed. Compared with the prior art, the ultrasonic soldering method for fast forming ceramic-metal interconnection is advantageous in that a joint compact and uniform in structure can be obtained in extremely short time, and the reliability problem caused by too long isothermal holding time is avoided; and in addition, oxide films on surfaces to be interconnected are destroyed by the ultrasonic effect, wetting and spreading of the middle layer in a molten state on the base materials are facilitated, and the quality of the joint is improved.

Description

technical field [0001] The invention belongs to the field of welding technology, and specifically relates to a simple, quick and easy-to-implement ultrasonic brazing method for rapidly forming ceramic-metal interconnections. Background technique [0002] Due to their excellent performance, ceramic materials are widely used in aerospace, petrochemical, automobile manufacturing and many other fields. For example, TiC, Ti(C,N)-based cermet materials have ultra-high hardness, good wear resistance, and excellent chemical stability, and have been developed into independent series of tool materials; SiC, GaN, diamond, ZnO, AlN As a new generation of wide-bandgap semiconductor materials, it has the characteristics of high thermal conductivity, large bandgap width, excellent electrochemical properties, and mechanical properties. High-temperature power devices based on it have been rapidly developed and widely used. The maximum service temperature is as high as 600°C. However, ceram...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/06B23K1/20B23K103/18
CPCB23K1/06B23K1/20B23K1/206
Inventor 李卓霖宋晓国董红杰赵洪运刘积厚田皓王世杰
Owner HARBIN INST OF TECH AT WEIHAI
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