Adhesive sheet for copper-clad laminate

A bonding sheet and copper-clad laminate technology, which is applied in the field of communication materials, can solve the problems of narrow adjustable range of dielectric properties of bonding sheets, increased production difficulty, and small usable range, achieving uniform thickness and easy control, and low production cost. Low, boost adjustable range of effects

Active Publication Date: 2017-04-26
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the composition of commercial adhesive sheets is fixed, the scope of use is small, and the price is expensive
Chinese patents CN101885900A, CN102794949B, CN103731980A, CN105898984A, CN101880441A and CN102558861B provide a variety of preparation methods for bonding sheets for copper clad lamin

Method used

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  • Adhesive sheet for copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 75 parts of PTFE (Japan Daikin PTFE M-18), 75 parts of PFA (DuPont Teflon PFA340), 70 parts of titanium dioxide (Tianjin Zhongzheng Huamei Technology) and 1 part of KH550 (Nanjing Shuguang Chemical General Factory), and mix them evenly with a high-speed mixer After that, at 360 o C. 120 kg / cm 2 After hot pressing and sintering for 24 hours, the bonding sheet is obtained by turning, and its thickness is about 0.095~0.105mm; the bonding sheet is pressed with the PTFE board at high temperature to obtain a multi-layer board, and then at 300 o C for 5 minutes, repeated 5 times, it can be observed that the multi-layer board has no blisters, no delamination, and almost no change in appearance, strength and toughness.

Embodiment 2

[0023]Weigh 150 parts of PTFE (Japan Daikin PTFE M-18), 10 parts of PFA (DuPont Teflon PFA340), 80 parts of titanium dioxide (Tianjin Zhongzheng Huamei Technology) and 2 parts of KH550 (Nanjing Shuguang Chemical General Factory), and mix them evenly with a high-speed mixer After that, at 430 o C. 200 kg / cm 2 After hot pressing and sintering for 24 hours, the bonding sheet is obtained by turning, and its thickness is about 0.095~0.105mm; the bonding sheet is pressed with the PTFE board at high temperature to obtain a multi-layer board, and then at 300 o C for 5 minutes, repeated 5 times, it can be observed that the multi-layer board has no blisters, no delamination, and almost no change in appearance, strength and toughness.

Embodiment 3

[0025] Weigh 110 parts of PTFE (Japan Daikin PTFE L-5), 30 parts of FEP (Japan Daikin Neoflon FEP NC-1539), 10 parts of ethylene-tetrafluoroethylene copolymer (ETFE) (DuPont Teflon Tefzel ETFE750), 50 parts Titanium dioxide (Tianjin Zhongzheng Huamei Technology), 30 parts of silicon dioxide (Xinyi Hongrun) and 1 part of KH550 (Nanjing Shuguang Chemical General Factory), after being uniformly mixed by a high-speed mixer, at 380 o C. 150 kg / cm 2 After hot pressing and sintering for 24 hours, the bonding sheet is obtained by turning, and its thickness is about 0.0105~0.115mm; the bonding sheet is pressed with the PTFE board at high temperature to obtain a multi-layer board, and then at 300 o C for 5 minutes, repeated 5 times, it can be observed that the multi-layer board has no blisters, no delamination, and almost no change in appearance, strength and toughness.

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Abstract

The invention belongs to the field of communication materials, and in particular relates to an adhesive sheet for a copper-clad laminate. The adhesive sheet with a controllable area, a smooth surface, a uniform easy-to-control thickness and suitable toughness and viscosity is prepared by mixing uniformly resin, an inorganic filler and an auxiliary agent, then hot pressing, sintering, turning, and the like. According to actual application scenes, various types of composite adhesive sheets are prepared by selecting of the suitable resin and inorganic filler, and prepregs with various polymer matrixes, different dielectric properties and different surface structures can be well composited. In particular, due to the use of glass fiber and other reinforcing materials, the dielectric properties of the adhesive sheet can be adjusted to a large extent, and the practicability and universality of the adhesive sheet can be effectively enhanced. In the invention, the adhesive sheets and the prepregs are well compatible and strong in adhesion, and a prepared multilayer board has good thermal and mechanical performances, high stability and low hygroscopicity, and can meet comprehensive performance requirements of different communication fields on the copper-clad laminate.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a bonding sheet for a copper clad laminate. Background technique [0002] Nowadays, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. As one of the key materials in the information electronics industry, copper clad laminates have been widely used in communication base stations, satellites, navigation and positioning systems, vending machines, computers, mobile phones and other fields. Prepregs are one of the basic components of copper clad laminates, and their composite conditions are crucial to the final performance of copper clad laminates. Especially the newly emerging fields of wearable devices, unmanned vehicles, drones and intelligent robots have put forward higher requirements for the comprehensive performance of copper clad laminates. In some cases, it is ...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J127/18C09J123/08C09J171/12C09J155/02C09J125/06C09J123/12C09J151/04C09J11/04C09J11/06C09J11/08
CPCC08L2205/025C08L2205/03C08L2205/035C09J7/00C09J11/04C09J11/06C09J11/08C09J125/06C09J127/18C09J171/12C09J2425/00C09J2427/00C09J2471/00C08L27/18C08K2003/2241C08K5/544C08L23/0892C08K3/36C08L71/12C08K13/02C08K2003/2227C08K5/523C08L23/12C08L55/02C08K5/098C08L51/04
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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