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Multilayer vapor chamber

A vapor chamber and bottom plate technology, applied in indirect heat exchangers, lighting and heating equipment, cooling/ventilation/heating transformation, etc., can solve the problem of affecting the heat transfer effect of pulsating heat pipes, affecting the formation of gas-liquid plugs, and affecting gas-liquid plugs Flow and other issues, to achieve the effect of simple structure, large equivalent heat transfer coefficient and strong pressure resistance

Inactive Publication Date: 2017-04-26
南京艾科美热能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this structure, the resistance at the connection between the channels is relatively large, which affects the flow of the gas-liquid plug. At the same time, the cross-section is a triangular equiangular structure, which affects the formation of the gas-liquid plug, and then affects the heat transfer effect of the pulsating heat pipe.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] combine figure 1 , figure 2 , Figure 7 and Figure 9 As shown, a multi-layer vapor chamber includes a cover plate 1, a bottom plate 2 and a middle plate 3, the middle plate 3 is arranged between the cover plate 1 and the bottom plate 2, and the cover plate 1, the bottom plate 2 and the middle plate 3 The size is the same; the opposite sides of two adjacent plates are respectively provided with a serpentine channel connected end to end at the corresponding positions, and the structures of the channels on the two surfaces corresponding to the adjacent two plates are the same, that is, the cover plate 1 and the middle One side of the plate is provided with a first channel 11, and the other side of the bottom plate 2 and the middle plate is provided with a second channel 21. The channels are connected by through holes 31; the connecting surfaces of two adjacent plates are welded, and the channels on the upper and lower sides form a closed cavity; the cavity is evacuate...

Embodiment 2

[0034] combine figure 1 , figure 2 , Figure 7 and Figure 10 As shown, a multi-layer vapor chamber includes a cover plate 1, a bottom plate 2 and a middle plate 3, the middle plate 3 is arranged between the cover plate 1 and the bottom plate 2, and the cover plate 1, the bottom plate 2 and the middle plate 3 The size is the same; the opposite sides of two adjacent plates are respectively provided with a serpentine channel connected end to end at the corresponding positions, and the structures of the channels on the two surfaces corresponding to the adjacent two plates are the same, that is, the cover plate 1 and the middle One side of the plate is provided with a first channel 11, and the other side of the bottom plate 2 and the middle plate is provided with a second channel 21, the cross section of the first channel 11 and the second channel 21 is semicircular with straight sides, semicircular The straight side structure of the shaped belt is composed of a semicircle and...

Embodiment 3

[0036] combine figure 1 , figure 2 , Figure 7 and Figure 11 As shown, a multi-layer vapor chamber includes a cover plate 1, a bottom plate 2 and a middle plate 3, the middle plate 3 is arranged between the cover plate 1 and the bottom plate 2, and the cover plate 1, the bottom plate 2 and the middle plate 3 The size is the same; the opposite sides of two adjacent plates are respectively provided with a serpentine channel connected end to end at the corresponding positions, and the structures of the channels on the two surfaces corresponding to the adjacent two plates are the same, that is, the cover plate 1 and the middle One side of the plate is provided with a first channel 11, and the other side of the bottom plate 2 and the middle plate is provided with a second channel 21. The channels are connected by through holes 31; the connecting surfaces of two adjacent plates are welded, and the channels on the upper and lower sides form a closed cavity; the cavity is evacuat...

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Abstract

The invention discloses a multilayer vapor chamber. The multilayer vapor chamber comprises a cover plate, a bottom plate and more than one middle plate, wherein the middle plates are arranged between the cover plate and the bottom plate, and the sizes of the cover plate, the bottom plate and the middle plates are identical; one or more parallel snakelike channels are formed in corresponding positions in two opposite sides of every two adjacent plates respectively and adopt identical structure, and the channels in upper and lower surfaces of each middle plate communicate via through holes; connecting surfaces of every two adjacent plates are welded, and the channels in upper and lower surfaces form a closed cavity; the cavities are vacuumized and filled with working media, and the working media perform evaporation condensation in the cavities to realize heat transfer. The multilayer vapor chamber is high in heat transfer efficiency, high in compression resistance, is not affected by a device placing direction, adopts simple manufacture process and is suitable for batch production.

Description

technical field [0001] The invention belongs to the field of enhanced heat transfer and cooling of electronic components, and in particular relates to a multilayer soaking plate. Background technique [0002] Thermal control of electronic equipment is a key technology that determines the stability and reliability of devices. With the development of high integration and high performance of electronic equipment, the requirements for heat dissipation of devices are also increasing. The concept of vapor chamber was proposed in the 1990s. It is a new type of high-efficiency heat transfer element. Its working principle is different from that of heat pipes. It mainly uses the pulsation and oscillation of the gas-liquid plug randomly generated by the working fluid at the evaporation end and the cooling end to complete heat transfer. Compared with traditional heat pipes, the process is more suitable for heat transfer in small spaces and high heat flux density. At the same time, the v...

Claims

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Application Information

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IPC IPC(8): F28D15/02H05K7/20
CPCF28D15/0233H05K7/20336
Inventor 徐德好杨佳解寺明余涛
Owner 南京艾科美热能科技有限公司