Resin synthetic board and manufacturing method thereof

Abstract

The invention discloses a resin synthetic board and a manufacturing method thereof, and belongs to the field of synthetic boards. The resin synthetic board is formed by laminating a resin synthetic board and a decorative film, wherein the decorative film is covered on the surface of the resin synthetic board; the resin synthetic board is prepared from the following components in percentage by mass: 10 to 15% of pine wood powder, 10 to 15% of fir wood powder, 40 to 69% of poplar wood powder, 0.01 to 0.08% of zinc stearate, 0.01 to 0.2% of titanium dioxide, and 10 to 40% of melamine formaldehyde resin; the decorative film is made of solid paper immersed by the melamine formaldehyde resin. The resin synthetic board has the advantages that the pine wood powder, the fir wood powder and the poplar wood powder are laminated into the high-density resin synthetic board, so that the high-density resin synthetic board has stronger anti-corrosive property, the easiness in aging is avoided, and the compressive strength is higher; the easiness in delaminating and falling of the decorative film is avoided, and the surface of the decorative film is smoother; after the decorative film is immersed by the melamine formaldehyde resin, the better abrasion-resistant property is realized.

Description

technical field [0001] The invention relates to a resin composite board and a manufacturing method thereof, belonging to the field of composite boards. Background technique [0002] High-density synthetic board is a common and widely used board. High-density synthetic board is made by soaking wood, branches and other objects in water, crushing and pressing them. It is made of wood fiber or other plant fibers, and glued together under the action of heat and pressure after applying adhesive. It is mainly used in the furniture and construction industry and in the manufacture of train and car carriages. When the high-density synthetic board is applied, the surface needs to be covered with a decorative film. However, there are defects in the composition of the current high-density composite board and its method of covering the decorative film: 1. The quality of the materials used in the current high-density composite board is uneven, which leads to the low compressive strength ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a resin composite board and its manufacturing method, which solves the problem of relatively poor physical indicators caused by the uneven quality of the materials used in the current composite board, and the low adhesion of the decorative film, which leads to easy Peeling and falling off, not resistant to wear and tear