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Photolithography tool

A kind of equipment and lithography technology, applied in microlithography exposure equipment, optomechanical equipment, photography, etc., can solve the problems of increasing the complexity of semiconductor components

Inactive Publication Date: 2017-05-10
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Nevertheless, the increased density of IC components, such as transistors, has also increased the complexity of handling semiconductor components with shrinking feature sizes

Method used

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  • Photolithography tool
  • Photolithography tool
  • Photolithography tool

Examples

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Embodiment Construction

[0011] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are merely examples and are not intended to be limiting. For example, in the following description, forming a first feature over or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where the first and second features may be formed in direct contact. An embodiment where additional features are formed between features such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat element numbers and / or letters in various instances. This repetition is for the purposes of brevity and clarity and does not in itself indicate a relationship between the variou...

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Abstract

A photolithography tool includes at least one process chamber, at least one front opening unified pod (FOUP) stage, at least one moving mechanism, and an image sensor. The moving mechanism is configured to move the wafer from the process chamber to the FOUP stage. The image sensor is configured to capture the image of the wafer on the moving mechanism.

Description

technical field [0001] This case is about lithography equipment. Background technique [0002] The fabrication of integrated circuits (ICs) can be facilitated by increasing the density of ICs formed in semiconductor devices. This can often be achieved by implementing more advanced design rules to allow for the formation of greater densities of IC components. Nonetheless, the increased density of IC components, such as transistors, has also increased the complexity of handling semiconductor components with shrinking feature sizes. Contents of the invention [0003] In some embodiments, a lithography equipment is provided, which is characterized in that it includes at least one processing chamber, at least one front opening unified pod (FOUP) platform, at least one moving mechanism, and an image sensor detector. The moving mechanism is configured to move at least one wafer from the processing chamber to the FOUP platform. The image sensor is configured to capture an imag...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/708G03F7/70975H01L22/12H01L21/67253H01L21/67259G01N21/8851G01N21/9501G03F7/70483
Inventor 廖嘉丰林俊贤苏倍毅戴逸明李忠兴廖建科张竣詠陈南荣吴沛远黄献茂
Owner TAIWAN SEMICON MFG CO LTD
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