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A structure-improved furnace carrier

A furnace and carrier technology, applied in the carrier field, can solve the problems of the carrier toppling, the clamp block is easy to be damaged, and the PCB board cannot be printed and pasted accurately, so as to achieve the effect of reducing damage and simple structure

Active Publication Date: 2018-11-06
浙江巨力宝纺织科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In SMT production, in order to save costs, people usually design the printed circuit board (PCB) of electronic products as a single board with no board edge. During SMT printing and placement, precise positioning cannot be performed, resulting in the inability to achieve accurate printing. patch
In order to solve the problem that the PCB board cannot be printed and mounted accurately, it is usually used to make a corresponding carrier, fix the PCB board on the carrier, print and mount it, and then carry out the furnace
The carrier is generally equipped with clips to fix the PCB board. The existing clips are generally installed on the surface of the carrier board on the carrier. When the carrier is not in use, it is generally placed together by stacking. The clamping block is not conducive to the stacking of the carrier, and it is easy to cause the carrier to fall. At the same time, the clamping block exposed on the surface of the carrier is often easily damaged

Method used

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  • A structure-improved furnace carrier
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  • A structure-improved furnace carrier

Examples

Experimental program
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Embodiment Construction

[0015] Example: see figure 1 , 2 , 3, a structurally improved furnace carrier, including a rectangular carrier board 1 and a PCB placement board 2, the PCB placement board 2 is plugged and fixed in the middle of the carrier board 1, and the four sides of the carrier board 1 are all A retaining strip 3 is fixed, and several rectangular grooves 31 are formed on the lower end surface of the retaining strip 3, and first stepped holes 32 are formed on both ends of the retaining strip 3 or on the retaining strip 3 between adjacent grooves 31 A fastening bolt 4 is inserted into the first step hole 32, and the fastening bolt 4 is screwed and fixed on the carrier plate 1; the groove 31 of the retaining bar 3 is inserted with a strip-shaped clamping block 5, and the groove 31 A second stepped hole 33 is formed on one side of the retaining bar 3 , and an adjusting bolt 6 is plugged into the second stepped hole 33 , and the adjusting bolt 6 is screwed on the clamping block 5 .

[0016] ...

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PUM

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Abstract

The invention discloses a furnace passing carrier with an improved structure. The carrier comprises a rectangular carrier plate and a PCB mounting plate, wherein the PCB mounting plate is inserted and fixed in the middle of the carrier plate; baffle bars are fixed on four side edges of the carrier plate; a plurality of rectangular grooves are formed in the lower end surfaces of the baffle bars; first step holes are formed in two ends of each baffle bar or the baffle bars between the adjacent grooves; fastening bolts are inserted in the first step holes; the fastening bolts are screwed and fixed to the carrier plate; the grooves of the baffle bars are inserted with bar-shaped clamping blocks; second step holes are formed in the baffle bars on one sides of the grooves; the second step holes are inserted with adjusting bolts; and the adjusting bolts are screwed to the clamping blocks. The carrier is simple in structure; an existing furnace passing carrier is improved, so that the furnace passing carrier can be stacked conveniently; and the clamping blocks can be hidden, so that the damage of the clamping blocks is reduced.

Description

Technical field: [0001] The present invention relates to the technical field of carriers, and more specifically relates to a structure-improved furnace carrier. Background technique: [0002] With the development of the electronic technology industry, the assembly of electronic products is developing towards high density, high precision, automation, miniaturization and low cost. Among related technologies, surface mount technology is a new generation of electronic assembly technology that adapts to technological development. In SMT production, in order to save costs, people usually design the printed circuit board (PCB) of electronic products as a single board without board edges. During SMT printing and placement, precise positioning cannot be performed, resulting in the inability to achieve accurate printing. patch. In order to solve the problem that the PCB board cannot be accurately printed and mounted, it is usually used to make a corresponding carrier, fix the PCB bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/0165
Inventor 李胜利
Owner 浙江巨力宝纺织科技有限公司