Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat sinks for solid insulated equipment

A technology of solid insulation and heat dissipation device, which is applied in the setting of switchgear with resin shell, cooling/ventilation of substation/switchgear, busbar/circuit arrangement, etc., which can solve the problem of limitation in improving heat dissipation efficiency.

Active Publication Date: 2019-05-31
KK TOSHIBA
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As a result, the temperature rise of the electrical components can be suppressed, and a large capacity can be realized. However, the above-mentioned heat sink and resin heat sink provide indirect heat dissipation through the insulating layer, and there is a limit to the improvement of heat dissipation efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat sinks for solid insulated equipment
  • Heat sinks for solid insulated equipment
  • Heat sinks for solid insulated equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] First, refer to Figure 1A to Figure 1C The solid insulating device and heat sink of Embodiment 1 will be described. Figure 1A is a front sectional view showing the structure of a solid insulating device, Figure 1B It is a front sectional view showing the structure of the heat sink of Embodiment 1 connected to a solid insulating device, Figure 1C Yes Figure 1B A-A sectional view.

[0025] like Figure 1A As shown, the solid insulating device 14 is a device for molding electrical components such as vacuum valves.

[0026] In this solid insulating device 14, a main circuit conductor 7 connected to the main circuit is provided, and an insulating layer 8 of the same material as the insulating layer 4 is provided on the outer periphery thereof.

[0027] in the Figure 1A Among them, the main circuit conductor 7 is branched into branch parts 7a, 7b, 7c, and a concave part is provided at the end of the branch part 7a. The connection conductor 3 is connected to this con...

Embodiment 2

[0050] Next, refer to Figure 2A as well as Figure 2B , the heat sink 15 of the second embodiment will be described. Figure 2A is a top sectional view showing the structure of the heat sink 15 according to Embodiment 2 of the present invention, Figure 2B Yes Figure 2A front section view.

[0051] In addition, this Example 2 differs from Example 1 in that a plurality of cooling plates are used.

[0052] In FIG. 2 , the same components as those in the first embodiment are assigned the same symbols, and their detailed descriptions are omitted.

[0053] like Figure 2A , Figure 2B As shown, a plurality of heat dissipation plates (radiation members) 2 a , 2 b , and 2 c are connected to the connection conductor 3 .

[0054] Between the cooling plates 2a, 2b, and 2c, they are arranged in parallel at predetermined intervals of several mm so as not to hinder the flow of air.

[0055] Moreover, if the end surfaces of the heat dissipation plates 2a and 2c at both ends are be...

Embodiment 3

[0058] Next, refer to Figure 3A as well as Figure 3B The heat sink 15 of the third embodiment will be described. Figure 3A is a top sectional view showing the structure of the heat sink 15 of Embodiment 3, Figure 3B Yes Figure 3A front section view.

[0059] In addition, this Example 3 differs from Example 1 in that the radiator plate is formed into a cross shape.

[0060] exist Figure 3A as well as Figure 3B In , the same components as those in Embodiment 1 are assigned the same symbols, and their detailed descriptions are omitted.

[0061] like Figure 3A as well as Figure 3B As shown, it is combined so that it may become a cross shape when 2 d of heat dissipation plates (radiation member) are seen from the upper surface. In addition, a plurality of cooling plates may be combined radially.

[0062] According to the heat sink 15 of the third embodiment described above, the same effect as that of the second embodiment can be obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The heat dissipation device of the solid insulating equipment of the present invention includes: a heat dissipation member (2) such as a heat dissipation plate, which has a predetermined area and is composed of a metal material; a connecting conductor (3) is fixed to the heat dissipation member (2) and is connected to the solid insulating equipment. An insulating layer (4) is arranged around the heat dissipating member (2) and the connecting conductor (3); an interface connecting portion (5) exposes the end of the connecting conductor (3); and a ground layer (6) , is arranged on the outer periphery of the insulating layer (4). The heat dissipating member (2) can be directly connected to the main circuit of the solid insulating device, and the temperature rise can be greatly suppressed.

Description

technical field [0001] Embodiments of the present invention relate to a heat sink for a solid insulating device in which electrical components constituting a switchgear are molded with an insulating material. Background technique [0002] Conventionally, in a solid insulating device in which an insulating material such as epoxy resin is used to mold electrical components constituting a switching mechanism such as a vacuum valve and a main circuit conductor, it is known to provide a ring-shaped heat sink on the outer periphery of the insulating layer. Technology for suppressing temperature rise (see, for example, Patent Document 1). [0003] In addition, there is known a technique for improving heat dissipation characteristics by providing resin heat sink fins protruding in a plate shape outside the insulating layer (see, for example, Patent Document 2). [0004] Thereby, the temperature rise of the electrical components can be suppressed, and a large capacity can be realize...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H02B1/56H01H33/662H02B1/20
CPCH01H33/662H02B1/20H02B1/56H02B13/01
Inventor 佐藤纯一浅利直纪宫内康寿久保田信孝
Owner KK TOSHIBA