Vacuum evaporation method

Abstract

The invention provides a vacuum evaporation method. The vacuum evaporation method comprises the following steps that an evaporation source for vacuum evaporation and a substrate to be plated are provided, the evaporation source for vacuum evaporation comprises evaporation materials, a carbon nano tube film structure, a first electrode and a second electrode, the first electrode and the second electrode are separated and electrically connected with the carbon nano tube film structure, the carbon nano tube film structure is a carrier, and the evaporation materials are arranged on the surface of the carbon nano tube film structure and carried through the carbon nano tube film structure; the evaporation source and the substrate to be plated are arranged oppositely in a spaced mode and vacuumized in a vacuum chamber; and electric signals are input into the carbon nano tube film structure to gasify the evaporation materials, and an evaporation layer is formed on the surface to be plated of the substrate to be plated.

Description

technical field [0001] The invention relates to the field of vacuum evaporation, in particular to a vacuum evaporation method. Background technique [0002] Vacuum evaporation is a process in which the evaporation source is heated in a vacuum to vaporize the evaporation material and deposit a film on the surface of the substrate to be coated. In order to form a uniform film, it is necessary to form a uniform vapor deposition material around the substrate to be plated. In the prior art (such as Chinese patent application CN1970826A), it is usually necessary to set up a complicated flow guide device to uniformly transport the gaseous evaporation material to the surface of the substrate to be plated. Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas. The larger the size of the coating, the more difficult ...

AI Technical Summary

Problems solved by technology

Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas

The larger the size of the coating, the more difficult it is to ensure the uniformity of the film formation, and because it is difficult to control the diffusion direction of the gaseous evaporation material atoms, most of the evaporation materials cannot be attached to the surface of the substrate to be coated, resulting in a low evaporation rate and Problems such as slow evaporation speed

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