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Vacuum deposition device

An evaporation and vacuum technology, applied in vacuum evaporation coating, sputtering coating, gaseous chemical plating, etc., can solve the problems of low evaporation rate, slow evaporation speed, and difficulty in ensuring uniformity of film formation, and achieve The effect of saving evaporation materials and increasing evaporation speed

Active Publication Date: 2019-09-03
TSINGHUA UNIV +1
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Problems solved by technology

Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas
The larger the size of the coating, the more difficult it is to ensure the uniformity of the film formation, and because it is difficult to control the diffusion direction of the gaseous evaporation material atoms, most of the evaporation materials cannot be attached to the surface of the substrate to be coated, resulting in a low evaporation rate and Problems such as slow evaporation speed

Method used

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Embodiment Construction

[0024] The vacuum evaporation device and the vacuum evaporation method of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0025] see figure 1 and figure 2 , The first embodiment of the present invention provides a vacuum evaporation device 10 , including an evaporation source 100 , a substrate to be coated 200 and a vacuum chamber 300 , and the evaporation source 100 and the substrate to be coated 200 are arranged in the vacuum chamber 300 . The substrate to be plated 200 is opposite to the evaporation source 100 and arranged at intervals, and the interval is preferably 1 micron to 10 mm.

[0026] The evaporation source 100 includes a carbon nanotube film structure 110 , a first electrode 120 , a second electrode 122 and an evaporation material 130 . The first electrode 120 and the second electrode 122 are spaced apart from each other and electrically connected to the carbon nanotube film structure 110 respect...

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Abstract

The present invention provides a vacuum steaming device, including evaporation source, basement base and vacuum chamber.The electrode and the second electrode, the first electrode and the second electrode are interval between each other and connect to the electron structure of the carbon nanopolytic membrane, respectively. The carbon nanopolytic membrane structure is a carrier.With the carbon nano -tube film structure, the base is relatively and the interval settings are relative to the carbon nano -tube membrane structure.

Description

technical field [0001] The invention relates to the field of vacuum evaporation, in particular to a vacuum evaporation device. Background technique [0002] Vacuum evaporation is a process in which the evaporation source is heated in a vacuum to vaporize the evaporation material and deposit a film on the surface of the substrate to be coated. In order to form a uniform film, it is necessary to form a uniform vapor deposition material around the substrate to be plated. In the prior art (such as Chinese patent application CN1970826A), it is usually necessary to set up a complicated flow guide device to uniformly transport the gaseous evaporation material to the surface of the substrate to be plated. Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas. The larger the size of the coating, the more difficult ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24
CPCC23C14/042C23C14/06C23C14/243C23C16/042C23C16/30C23C16/4485C23C14/24
Inventor 魏洋魏浩明姜开利范守善
Owner TSINGHUA UNIV
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