Vacuum deposition method

Abstract

The invention provides a vacuum evaporation method, comprising the following steps: providing an evaporation source and a substrate to be plated, the evaporation source includes an evaporation material and a carbon nanotube film structure, the carbon nanotube film structure is a carrier, and the evaporation material is arranged on The surface of the carbon nanotube film structure is carried by the carbon nanotube film structure; the evaporation source is opposite to the substrate to be plated and spaced in a vacuum chamber and vacuumized; and the carbon nanotube film is supplied to the carbon nanotube film through an electromagnetic wave signal input device An electromagnetic wave signal is input into the structure to vaporize the evaporating material and form an evaporating layer on the surface to be plated of the base to be plated.

Description

technical field [0001] The invention relates to the field of vacuum evaporation, in particular to a vacuum evaporation method. Background technique [0002] Vacuum evaporation is a process in which the evaporation source is heated in a vacuum to vaporize the evaporation material and deposit a film on the surface of the substrate to be coated. In order to form a uniform film, it is necessary to form a uniform vapor deposition material around the substrate to be plated. In the prior art (such as Chinese patent application CN1970826A), it is usually necessary to set up a complicated flow guide device to uniformly transport the gaseous evaporation material to the surface of the substrate to be plated. Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas. The larger the size of the coating, the more difficult ...

AI Technical Summary

Problems solved by technology

Especially when there are two or more evaporation sources, it is more difficult to control the evaporation rate of each evaporation source, and it is difficult to form a predetermined ratio of mixed evaporation material gas

The larger the size of the coating, the more difficult it is to ensure the uniformity of the film formation, and because it is difficult to control the diffusion direction of the gaseous evaporation material atoms, most of the evaporation materials cannot be attached to the surface of the substrate to be coated, resulting in a low evaporation rate and Problems such as slow evaporation speed

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