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A kind of processing technology of pth orifice plate

A processing technology, orifice plate technology, used in secondary processing of printed circuits, reinforcement of conductive patterns, printed circuits, etc., can solve the problems of PTH holes and hole ring gold infiltration.

Active Publication Date: 2020-02-07
GUANGZHOU MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a treatment process for PTH orifice plates to solve the problem of gold penetration in PTH holes and hole rings

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Below, in conjunction with specific embodiment, the present invention is described further:

[0019] A treatment process for a PTH hole plate, comprising the following steps in turn: 1) pattern transfer; 2) solder resist; 3) pasting a dry film, and pasting a dry film on the PTH hole; 4) depositing nickel and gold on a bare copper surface Electroless nickel plating, then carry out chemical immersion gold; It is characterized in that, between step 3) and step 4), also includes step 3-1) sticking red tape, sticking red tape on the PTH hole with dry film .

[0020] In step 1), the operation process of graphic transfer is as follows: chemical pretreatment → film application → first exposure → dry film application → second exposure → development.

[0021] In step 2), the operation process of solder resist is as follows: chemical pretreatment → silk screen → pre-baking → exposure → development → post-baking.

[0022] In step 3), the operation process of pasting the dry film ...

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Abstract

The invention discloses a treatment process of a PTH (Plating Through Hole) plate. The treatment process comprises the following successive steps: (1) transferring patterns; (2) carrying outresistance welding; (3) sticking a dry film, namely sticking the dry film on PTH pores; and (4) carrying out nickle and gold precipitation, namely also comprising a step (3-1) of sticking a red adhesive tape between the step (3) and the step (4), namely, sticking the red adhesive tape on the PTH stuck with the dry film. The treatment process disclosed by the invention has the advantages that no breaking of the dry film in the process of nickle and gold precipitation is guaranteed, so that no gold filtration of the PTH pores and pore rings is guaranteed.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a processing technology of a PTH orifice plate. Background technique [0002] PTH (Platating Through Hole) is a sunken copper hole on a printed circuit board (PCB). The hole wall has copper, which is generally a via hole and a component hole. A printed circuit board provided with PTH holes can be called a PTH hole plate, and the surface treatment of the PTH hole plate generally includes OSP and immersion nickel gold. Among them, OSP is a process of PCB copper foil surface treatment, which is to grow a layer of organic film on the clean bare copper surface by chemical method. This film has the properties of anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rusting in normal environment. Immersion nickel gold is also called electroless nickel gold or immersion nickel immersion gold (Electroless...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/24H05K3/28
CPCH05K3/24H05K3/282H05K2203/072H05K2203/143
Inventor 罗郁新
Owner GUANGZHOU MEADVILLE ELECTRONICS