Organic light-emitting diode device and production method thereof

Abstract

The invention discloses an organic light-emitting diode device. The light-emitting diode device comprises a substrate; an OLED unit disposed on the substrate; and a packaging structure, which is connected with the substrate, and is used for packaging the OLED unit. The packaging structure comprises a first inorganic barrier layer disposed on the outer side of the OLED unit in a wrapped manner, an inorganic nanometer-organic copolymer mixing layer disposed on the outer side of the first inorganic barrier layer in a wrapped manner, and a second inorganic barrier layer disposed on the outer side of the inorganic nanometer-organic copolymer mixing layer in a wrapped manner. The organic light-emitting diode device has advantages of good water oxygen barrier performance, thin thickness, and strong interface bonding force. The invention also provides the production method of the organic light-emitting diode device.

Description

[0001] 【Technical field】 [0002] The invention relates to the technical field of light emitting diodes, in particular to an organic light emitting diode device and a manufacturing method thereof. [0003] 【Background technique】 [0004] Organic Light-Emitting Diode (OLED) devices can be used as light sources for display devices and lighting devices. The organic light emitting diode device mainly includes a substrate, an OLED unit disposed on the substrate, and an encapsulation structure for encapsulating the OLED unit. The function of the encapsulation structure is to block the penetration of water and oxygen molecules, so as to prevent the damage of the OLED unit. [0005] OLED unit encapsulation usually adopts two methods, one is encapsulation lid encapsulation technology, and the other is thin film encapsulation technology. Among them, the encapsulation technology of the encapsulation cover is to carry out the dispensing process on the encapsulation cover, and then carry ...

AI Technical Summary

Problems solved by technology

The organic light-emitting diode device formed has excellent water-oxygen gas barrier ability, WVTR<10E-6g / m2 / day, but has the following defects: the thickness is relatively thick, up to 0.5-0.7mm, the process is relatively complicated, and the preparation process requires High temperature conditions may have an impact on the cathode of the OLED unit, and the resulting organic light-emitting diode device has the characteristics of poor flexibility and cannot be bent

However, thin-film packaging technology cannot completely solve the problem of water and oxygen penetration. First, because the inorganic thin film is formed by CVD film-forming process, specifically, it is a chemical gas phase reaction triggered by plasma plasma, and active molecules diffuse and adsorb on the substrate to form islands. Forming a continuous film, the process will inevitably produce pinholes and gaps, thereby reducing its water vapor barrier ability; the second is because the organic film has too high a permeability to gas molecules

To solve the problem of water and oxygen permeation in thin-film packaging technology, on the one hand, it is necessary to increase the stacking of the entire thin-film packaging layer to delay the penetration time of gas molecules; on the other hand, it is necessary to increase the thickness of the organic film to further improve product reliability. Only 10-15μm can achieve commercial application effect, which will lead to high production cost and complicated process in the current OLED industry

In addition, in the thin film packaging technology, the inorganic thin film and the organic thin film are two different phases, the interface adhesion is poor, and the thin film is prone to peeling off, which further aggravates the problem of water and oxygen penetration.

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