Dual-camera module set

A dual-camera and lens module technology, used in image communication, TV, color TV components and other directions, can solve problems such as affecting imaging quality, non-parallel central axes, and tilting.

Pending Publication Date: 2017-06-09
NANCHANG OFILM HUAGUANG TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the two image sensor chips are assembled on the circuit board, it is easy to be tilted

Method used

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Embodiment Construction

[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0025] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected ...

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Abstract

The present invention relates to a dual-camera module set. The dual-camera module set comprises a circuit board, a substrate and two flip chips; the substrate is arranged on the circuit board and is electrically connected with the circuit board; first through holes are formed in the substrate; the side wall of one end of each first through hole is recessed towards a direction far away from the circuit board so as to form a first recessed groove, wherein the one end of the first through hole is close to the circuit board; the flatness of the first recessed grooves is greater than the flatness of the circuit board; and the two flip chips are encapsulated in the bottoms of the two first recessed grooves. Since the two flip chips are encapsulated in the bottoms of the two first recessed grooves, the chips have less possibility of tilting compared with chips encapsulated by a traditional mode according to which the image sensing chips are directly arranged on a circuit board, and therefore, the parallelism of the central axes of the two flip chips is higher, and imaging quality can be improved.

Description

technical field [0001] The invention relates to the technical field of camera modules, in particular to a dual camera module. Background technique [0002] The dual camera module includes two independent cameras installed on the same circuit board. The two cameras can take pictures of the same object in the same direction at the same time, and generate the first image and the second image respectively. The first image and the second image can be Composite three-dimensional images can also compensate each other to obtain high-definition two-dimensional images. [0003] A dual camera module usually includes two lens units, two lens assembly seats, two infrared cut filters, two image sensor chips and a circuit board. When the image sensor chip is assembled with the circuit board, glue is first dispensed on the predetermined position of the circuit board, and the two image sensor chips are respectively assembled to the predetermined position (die bonding), and bonded and fixed ...

Claims

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Application Information

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IPC IPC(8): H04N5/225
Inventor 王昕
Owner NANCHANG OFILM HUAGUANG TECH CO LTD
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