Electronic component conveying apparatus and electronic component inspection apparatus

A technology for electronic components and conveying devices, used in conveyors, measuring devices, mechanical conveyors, etc.

Inactive Publication Date: 2017-06-13
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, in conventional electronic component inspection devices, the conveyance direction of electronic components around the inspection part is usually limited to one direction, but there are cases where the user wants to change the conveyance direction depending on the user who uses the electronic component inspection device.

Method used

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  • Electronic component conveying apparatus and electronic component inspection apparatus
  • Electronic component conveying apparatus and electronic component inspection apparatus
  • Electronic component conveying apparatus and electronic component inspection apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0181] figure 1 It is a schematic perspective view which looked at 1st Embodiment of the electronic component inspection apparatus of this invention from the front side. figure 2 yes means figure 1 It is a schematic plan view of the normal operation state of the electronic component inspection apparatus shown. Figure 3 ~ Figure 8 respectively in order figure 1 A schematic plan view of the retest operation state of the electronic component inspection apparatus shown. Figure 12 to Figure 14 respectively in figure 1 An example of an operation screen used for setting the retest operation of the electronic component inspection apparatus shown is shown. Figure 15 is in figure 1 An example of an operation panel used for setting the retest operation of the electronic component inspection apparatus shown is shown.

[0182] Hereinafter, a first embodiment of an electronic component conveying device and an electronic component inspection device according to the present inventio...

no. 2 approach

[0248] Figure 9 It is a schematic plan view sequentially showing the retest operation state of the electronic component inspection device (second embodiment) of the present invention.

[0249] Hereinafter, a second embodiment of the electronic component conveying device and the electronic component inspection device according to the present invention will be described with reference to this figure, and the differences from the above-mentioned embodiment will be mainly described, and the description of the same matters will be omitted.

[0250] The inspection apparatus 1A of this embodiment is the same as the above-mentioned first embodiment except that the second inspection is different.

[0251] In the inspection apparatus 1A of the present embodiment, the second inspection is an inspection different from the first inspection, and is an inspection in which inspection conditions are changed for the IC device 90 after the first inspection. The second inspection is not particu...

no. 3 approach

[0256] Figure 10 as well as Figure 11 Each is a schematic plan view sequentially showing the retest operation state of the electronic component inspection apparatus (third embodiment) of the present invention.

[0257] Hereinafter, a third embodiment of the electronic component conveying device and the electronic component inspection device according to the present invention will be described with reference to the above-mentioned drawings, and the differences from the above-mentioned embodiment will be mainly described, and the description of the same matters will be omitted.

[0258] The inspection apparatus 1B of this embodiment is the same as the above-mentioned 1st Embodiment except the setting position of a 1st position and a 2nd position being different.

[0259] Such as Figure 10 , Figure 11 As shown, in the inspection device 1B of this embodiment, the first position P1b and the second position P2b are inside the inspection device 1B, the first position P1b is se...

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PUM

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Abstract

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus, which can efficiently convey, for example, an electronic component to be re-inspected. The electronic component conveying apparatus of the present invention includes a conveyance unit (23) which can be used to convey a tray (200) that serves as a carrying member that carries an electronic component, which is an IC device (90). The conveyance unit (23) conveys the tray (200), which carries the IC device (90), to a first position where the IC device (90) is arranged before the first inspection, and to a second position for performing the second inspection of the IC device (90) after the first inspection, wherein the first position is different from the second position.

Description

technical field [0001] The present invention relates to an electronic component conveying device and an electronic component inspection device. Background technique [0002] Conventionally, there is known an electronic component inspection apparatus for inspecting electrical characteristics of electronic components such as semiconductor elements, and the electronic component inspection apparatus is configured to classify electronic components based on inspection results by an inspection unit. Furthermore, this classification includes "inspection result pass", "inspection result fail", "reinspection required (for example, refer to patent document 1)", etc. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2000-258507 [0004] In the conventional electronic component inspection device, when the inspection result of the electrical characteristics is "need to re-inspect", the corresponding electronic component must be placed in the electronic component inspection device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G35/00G01R31/26
CPCB65G35/00G01R31/2601
Inventor 高田冬生清水博之桐原大辅
Owner SEIKO EPSON CORP
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