Packaging structure and packaging method of oled display panel

Abstract

A packaging structure and packaging method of an OLED display panel, including a substrate and a cover plate, the substrate includes a first substrate, a plurality of pixel regions are formed on the first substrate, and an OLED device and a driver are formed in each pixel region. The pixel circuit of the OLED device, the OLED device is located on the pixel circuit, the cover plate includes a second substrate, the substrate forms a metal isolation wall around the pixel area, and the metal isolation wall is perpendicular to the first substrate and protrudes On the surface of the OLED device, a metal layer is formed on the second substrate, the position of the metal layer corresponds to the position of the metal separation wall, the melting point of the metal layer is lower than the melting point of the metal separation wall, and the metal layer Soldering with the metal separation wall seals the OLED device in the metal separation wall. In this embodiment, a metal isolation wall is formed around the pixel area, a welding metal layer is formed on the corresponding position on the cover plate, and then the cover plate and the substrate are sealed by thermocompression welding, which improves the packaging effect and reduces the frame size of the screen body .

Description

technical field [0001] The present invention relates to the technical field of OLED display panels, in particular to a packaging structure and packaging method of OLED display panels. Background technique [0002] Organic light-emitting diode OLED (Organic Light-Emitting Diode) display, as a new type of flat panel display, has the characteristics of active light emission, high luminous brightness, high resolution, wide viewing angle, fast response speed, low energy consumption and flexibility. It has received more and more attention and has become a next-generation display technology that may replace liquid crystal displays. [0003] Organic layer materials that are extremely sensitive to water vapor and oxygen exist in the OLED display panel, which greatly reduces the lifespan of the OLED display panel. In order to solve this problem, in the prior art, various materials are mainly used to encapsulate the OLED display panel to protect the organic layer materials. [0004] ...

AI Technical Summary

Problems solved by technology

Frit coating adopts screen printing, and the width generally reaches hundreds of microns. In addition, there are circuits and other traces on the edge of the display area, so the frame of the screen is still relatively wide (above 1mm), and the user experience is still not enough. it is good

At the same time, due to the need to use laser to melt Frit, the temperature is relatively high, which is easy to damage the wiring and circuits around the screen. The packaging effect of Frit is often affected by the air bubbles in the Frit paste, resulting in package failure.

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