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Printed circuit board structure having electromagnetic-tunnel embedded architecture and method for manufacturing the same

A technology in printed circuit boards and tunnels, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of electromagnetic wave tube winding, multi-space, etc., to prevent interference, minimize signal distortion and loss, and bond. or the effect of simplifying the welding process

Inactive Publication Date: 2017-07-25
KOREA ADVANCED INST OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, using the existing electromagnetic signal transmission technology between chips of the electromagnetic wave tube 230, when the printed circuit board 200 is connected with other printed circuit boards, not only the electromagnetic wave tube 230 connecting the chips is added on the printed circuit board 200, but also the printed circuit board 200 is added. The circuit board 200 and the electromagnetic wave tubes of other printed circuit boards have the disadvantages that the electromagnetic wave tubes are complicatedly intertwined with each other and occupy a lot of space

Method used

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  • Printed circuit board structure having electromagnetic-tunnel embedded architecture and method for manufacturing the same
  • Printed circuit board structure having electromagnetic-tunnel embedded architecture and method for manufacturing the same
  • Printed circuit board structure having electromagnetic-tunnel embedded architecture and method for manufacturing the same

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Embodiment Construction

[0041] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited or limited to the Examples. And the same reference symbols appearing in the various drawings denote the same components.

[0042] In addition, the terms (terminology) used in this specification are used to properly express the preferred embodiments of the present invention, and may vary depending on the intention of users and operators, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the content involved in the present invention as a whole.

[0043] Figure 3a to Figure 3c is a diagram showing the structure of a printed circuit board according to an embodiment. Specifically, Figure 3a is a diagram showing a longitudinal sectional view of a printed circuit board according to an embodiment, Figure 3b is a diagram showing a cross-se...

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Abstract

Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture and a method for manufacturing the same. The printed-circuit board (PCB) structure having the electromagnetic-tunnel-embedded architecture comprises a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

Description

technical field [0001] The following embodiments relate to a printed circuit board (PCB, Printed Circuit Board) with a built-in structure of an electromagnetic waveguide (electromagnetic waveguide), that is, an electromagnetic tunnel (Electro Magnetic tunnel), and a manufacturing method thereof. The printed circuit board includes an EM tunnel built in at least one horizontal part and at least one vertical part, and transmits electromagnetic wave signals through the EM tunnel built in the printed circuit board. Background technique [0002] A server computer in a data center or a mobile communication system requires a substrate suitable for large-capacity ultra-high-speed data processing. In this regard, as a substrate technology for large-capacity and ultra-high-speed data processing, although a highly integrated printed circuit board technology using a multilayer circuit with a high density of metal wiring has been developed, there is a problem that as the data transmission...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H01P3/16
CPCH01P3/122H01P1/042H01P3/165H01P5/02H01P5/087H01P5/107H01P11/001H01P11/006H05K1/0243H05K1/0216H01P3/16H05K2201/09809
Inventor 朴孝勋裴玄民李泰雨
Owner KOREA ADVANCED INST OF SCI & TECH
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