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Array button, cutting mold, packaging structure and button production method

A production method and array technology, applied in packaging, metal processing and other directions, can solve the problems that affect the solderability of patch-type elastic key components, affect the welding quality of patch key components, and restrict the production rate of tape and tape packaging. Avoid damage and pollution, ensure location accuracy, and improve production efficiency

Active Publication Date: 2019-12-27
桂林研创半导体科技有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, a single patch-type elastic button component needs to undergo processes such as punching, bulk material accumulation, and vibration feeding, which not only easily affects the coplanarity of the solder feet of the button, but also easily causes surface contamination of the solder feet, which directly affects the surface of the patch. On the other hand, because the shape of the patch-type silicone elastic key is different from that of general electronic components, and because of its inherent elastic characteristics, it is difficult to use a vibrating plate to carry out the die-cut silicone elastic key. When taping and packaging, the key is accurately vibrated to the delivery card position and the loading speed is slow. In addition, after the key enters the card position, it needs to be further judged and the direction corrected before entering the final quality inspection and packaging steps.
It can be seen that the existing tape packaging method for electronic components is used in the tape packaging of patch type elastic button components.

Method used

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  • Array button, cutting mold, packaging structure and button production method
  • Array button, cutting mold, packaging structure and button production method
  • Array button, cutting mold, packaging structure and button production method

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Embodiment Construction

[0059] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0060] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0061] Refer below Figure 1 to Figure 8 Describe the array key, cutting mold, packaging structure and key production method according to some embodiments of the present invention.

[0062] In the ...

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PUM

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Abstract

Array-type buttons, a cutting mould, a packaging structure and a button production method. The array-type buttons comprise: a plurality of button bodies (102) and a support (104), the plurality of button bodies (102) being arranged in an array, and being connected to one another by means of a connection portion (106); the support (104) being connected to the button bodies (102) by means of the connection portion (106), for supporting the button bodies (102); the support (104) being provided with positioning holes (108), for positioning the array-type buttons during the manufacturing. The support (104) supports the plurality of button bodies (102), and the support (104) is provided with positioning holes (108) for positioning the array-type buttons during the manufacture, such that buttons obtained by cutting such array-type buttons are arranged according to a preset order and positions, saving the process step of re-distributing by means of shaking, ensuring correct ordering and positioning of the buttons while avoiding the damage and dirt on the buttons due to the distributing by means of shaking, ensuring the reliability of buttons during use.

Description

technical field [0001] The invention relates to the technical field of buttons, in particular to an array button, a cutting mold, a packaging structure and a button production method. Background technique [0002] At present, in the related technology, the braiding method of the elastic button needs to firstly remove the welding protective cover from the semi-finished product of the array type elastic button element formed by molding, and punch it into a single patch type elastic button element, and then the patch type The bulk material of the elastic button components is put into the vibrating plate, and the button components are accurately landed on the card position through vibration, and then the direction of the buttons is determined and corrected, and then enters the steps of quality inspection and packaging. On the one hand, a single patch-type elastic button component needs to undergo processes such as punching, bulk material accumulation, and vibration feeding, whic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/38B26F1/44B26D7/06B26D7/01B65B15/04
CPCB26D7/01B26D7/06B26F1/38B26F1/44B65B15/04
Inventor 蔡苗杨道国王思宇郑建娜梁永湖杨笛
Owner 桂林研创半导体科技有限责任公司