Array button, cutting mold, packaging structure and button production method
A production method and array technology, applied in packaging, metal processing and other directions, can solve the problems that affect the solderability of patch-type elastic key components, affect the welding quality of patch key components, and restrict the production rate of tape and tape packaging. Avoid damage and pollution, ensure location accuracy, and improve production efficiency
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[0059] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.
[0060] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
[0061] Refer below Figure 1 to Figure 8 Describe the array key, cutting mold, packaging structure and key production method according to some embodiments of the present invention.
[0062] In the ...
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