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A server structure design method, system and deployment method

A technology for structural design and server applications in the fields of instruments, computing, digital data processing components, etc.

Active Publication Date: 2020-07-07
GUANGDONG INSPUR BIG DATA RES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Liquid cooling is the development direction of heat dissipation, but liquid cooling still has some technical problems in server applications, and it will take some time to widely use liquid cooling to solve server heat dissipation

Method used

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  • A server structure design method, system and deployment method
  • A server structure design method, system and deployment method
  • A server structure design method, system and deployment method

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Embodiment Construction

[0029] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] The present invention uses a new type of server structure design and use method that uses the chassis wall to dissipate heat. Based on the analysis of the internal components of the server, it is found that some components can not solve the heat dissipation problem by using a common method, which requires the use of heat conducting sheets to guide the heat of the components to the chassis wall. for auxiliary cooling.

[0031] The following factors need to be considered when designing the server:

[0032] (1) Which surfaces of the chassis wall are used for auxiliary heat dissipation;

[0033] (2) Use part of a certain surface of the chassis wall or all of it t...

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Abstract

The invention provides a server structure design method and system and a deployment method. The situation that part of parts cannot solve the problem of heat dissipation in a common mode is found on the basis of analyzing server internal parts, by means of the scheme, a novel server is designed, heat of the parts is conducted to the wall of a case for auxiliary heat dissipation through heat conducting fins, and therefore the problem of heat dissipation is solved.

Description

technical field [0001] The invention relates to the field of heat dissipation treatment of electronic equipment such as servers and communication products, and in particular to a server structure design method, system and server deployment method. Background technique [0002] As the components in the server chassis become denser and the energy consumption of the components is higher and higher, the heat in the chassis is increasing, how to effectively solve the heat dissipation problem of the server has always been a difficult problem. [0003] Liquid cooling is the development direction of heat dissipation, but liquid cooling still has some technical problems in server applications, and it will take some time to widely use liquid cooling to solve server heat dissipation. [0004] Adding some new heat dissipation methods to supplement the existing server heat dissipation methods, and solving some outstanding problems in the server are currently effective methods. Contents...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/206
Inventor 石江涛陈彦灵吴安
Owner GUANGDONG INSPUR BIG DATA RES CO LTD