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adhesive sheet

A technology for adhesive sheets and wafers, applied in the direction of adhesives, film/sheet adhesives, synthetic resin layered products, etc., which can solve the problems of excessive softening of the intermediate layer, exudation of the intermediate layer, and absorption of bump height differences. , to achieve the effect of good embedding and preventing exudation

Active Publication Date: 2020-04-07
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when only energy ray-curable resin is used, the intermediate layer may soften excessively at the bonding temperature, causing bleeding of the intermediate layer during bonding, and the intermediate layer may not be able to sufficiently absorb the height difference of the bumps.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0161] (formation of middle layer)

[0162] 40 parts by mass (solid content ratio) of a bifunctional urethane acrylate oligomer (product name "CN9018", manufactured by Arkema Corporation, weight average molecular weight: 45,000) as a polyfunctional compound, and acrylic acid as a crystalline monomer 60 parts by mass of octaalkyl ester (STA) (solid content ratio), and 2,4,6-trimethylbenzoyl diphenylphosphine oxide (product name " DAROCUR TPO ", BASF company Production) 2.0 parts by mass (solid content ratio) were mixed to obtain a UV-curable composition for an intermediate layer. The composition for the intermediate layer was coated on a release film of polyethylene terephthalate (PET) film (product name "SP-PET381031", Lintec Co., Ltd. Co., Ltd., thickness 38 μm), a coating film was formed so that the thickness after curing was 200 μm.

[0163] Then, the coating film was cured by irradiating ultraviolet rays from the coating film side, and a substrate formed of a polyethylen...

Embodiment 2

[0168] As a multifunctional compound, a liquid butadiene polymer (product name "Ricon 154", manufactured by Crayvalley Co., Ltd., weight average molecular weight 5200) having a plurality of vinyl groups in the side chain was used, except that it was carried out in the same manner as in Example 1, An adhesive sheet was obtained.

Embodiment 3

[0170] As the polyfunctional compound, a bifunctional polyalkylacrylate (product name "RC100C", manufactured by Kaneka Co., Ltd., weight average molecular weight: 20,000) having polymerizable functional groups at both ends was used, except that it was the same as in Example 1. implemented.

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Abstract

The adhesive sheet (10A) of the present invention comprises in order: a substrate (11), an intermediate layer (12) and an adhesive layer (13), wherein the intermediate layer (12) will contain a polyfunctional compound and a monofunctional monomer The intermediate layer composition is cured, the polyfunctional compound has at least two polymerizable functional groups, and the monofunctional monomer includes at least a crystalline monomer having a straight carbon chain with 14 to 22 carbon atoms, The composition for an intermediate layer contains more than 25% by mass of the polyfunctional compound relative to the monofunctional monomer.

Description

technical field [0001] The present invention relates to an adhesive sheet that is attached to an adherend such as a semiconductor wafer and used for protecting the adherend, and particularly relates to a backgrinding sheet. Background technique [0002] In the process of rapid thinning, miniaturization, and multifunctionalization of information terminal equipment, semiconductor devices mounted therein are also required to be thinner and higher in density. In order to reduce the thickness of devices, it is desired to reduce the thickness of semiconductor wafers on which semiconductors are integrated. In order to meet this demand, studies are underway to reduce the thickness of semiconductor wafers by grinding them. [0003] In addition, in recent years, bumps made of solder or the like having a height of about 30 to 100 μm are sometimes formed on the wafer surface, and the back surface of the semiconductor wafer having irregularities is sometimes ground. When back grinding ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304C09J7/20
CPCB32B27/00B32B27/30C09J201/00H01L21/304C09J7/20C09J2203/326
Inventor 垣内康彦藤本泰史
Owner LINTEC CORP